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48results about How to "Effect of mechanical strength" patented technology

Three-dimensional connected honeycomb porous calcium phosphate ceramic artificial bone material and preparation method thereof

The invention discloses a three-dimensional connected honeycomb porous calcium phosphate ceramic artificial bone material. A plurality of longitudinal straight-through holes are distributed in the calcium phosphate ceramic artificial bone material in a honeycomb manner; and a plurality of transverse through holes are distributed in the hole walls of the straight-through holes to connect the adjacent straight-through holes. The invention also discloses a preparation method of the three-dimensional connected honeycomb porous calcium phosphate ceramic artificial bone material. The three-dimensional connected honeycomb porous calcium phosphate ceramic artificial bone material is prepared once through an extrusion molding technology and a pore forming agent adding technology. The straight-through holes are helpful for growing newborn bone tissues and forming blood vessels, and the three-dimensional connected holes are helpful for connecting cells into pieces and facilitate transportation of nutrient substances and discharging of metabolites. The preparation method is simple and can realize continuous production; and the prepared porous calcium phosphate ceramic has the advantages of high porosity, high connectivity and good mechanical performances.
Owner:SOUTH CHINA UNIV OF TECH

Cover layer of semiconductor device interconnected structure and manufacturing method thereof

The invention relates to a manufacturing method for a cover layer of a semiconductor device interconnected structure. The manufacturing method comprises the following steps: providing a semiconductor device interconnected structure matrix provided with interlevel dielectrics; forming a bottom cover layer on the interlevel dielectrics; forming a first sandwich layer in the bottom cover layer; and forming a top cover layer on the bottom cover layer and the first sandwich layer. Correspondingly, the invention also provides the cover layer of the semiconductor device interconnected structure. The invention adopts a compound medium layer as the cover layer of the semiconductor device interconnected structure, improves the mechanical strength of the whole interconnected structure and ensures that a chip is not easy to break in the use process. While further improving the mechanical strength of the whole interconnected structure, the metal material with higher thermal conduction in the cover layer can easily and timely dissipate heat generated in the working process of the chip so as to ensure that the chip cannot be burned down due to overhigh temperature and ensure the working efficiency and the stability of the chip.
Owner:SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORP

Semiconductor device interconnected structure and manufacturing method thereof

The invention relates to a manufacturing method for a semiconductor device interconnected structure. The manufacturing method comprises the steps of providing a semiconductor device interconnected structure matrix provided with interlevel dielectrics, and forming a compound medium layer on the semiconductor device interconnected structure matrix. The compound medium layer comprises a bottom cover layer arranged on the bottom of the compound medium layer, a sandwich layer arranged in a sandwich layer groove, and a top cover layer arranged on the top of the compound medium layer, wherein the sandwich layer groove is arranged in the bottom cover layer. The invention also provides the semiconductor device interconnected structure. The invention adopts the compound medium layer as the top cover layer, improves the mechanical strength of the whole interconnected structure and ensures that a chip is not easy to break in the use process. The material with higher thermal conduction in the top cover layer can easily and timely dissipate the heat generated in the working process of the chip, ensures that the chip cannot be burned down due to overhigh temperature and ensures the working efficiency and the stability of the chip.
Owner:SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORP

Road inspection well and manufacturing process and construction method thereof

The invention relates to the technical field of road inspection well construction, in particular to a road inspection well and a manufacturing process and a construction method thereof. The concrete is prepared from the following raw materials: Portland cement, medium sand, super absorbent resin, pebbles, a fiber mixture, fly ash, an expanding agent, a polycarboxylate superplasticizer, gravel-typegranules, montmorillonite powder, attapulgite, a retarder, an early strength agent and water. The fiber mixture is used as a raw material for preparing the road inspection well, wherein the fiber mixture is formed by mixing polypropylene fibers and steel fibers according to a certain proportion, as a result, the polypropylene fibers and the steel fibers are matched with each other to effectivelyreduce the volume shrinkage phenomenon of the road inspection well in the early stage, and the anti-cracking performance of the road inspection well is improved; and moreover, proper vibration compaction treatment is carried out on the concrete during pouring, so that the compactness and the uniformity of the concrete are improved and guaranteed, the crack resistance and the bearing capacity of the road inspection well are remarkably improved, and the service life of the road inspection well is effectively prolonged.
Owner:漳州明威建材发展有限公司

Automatic spaceflight high-pressure inflation and deflation system and method

The invention relates to an automatic spaceflight high-pressure inflation and deflation system and method. The system comprises a gas adding module, a gas driving module and a control module. The gas adding module comprises a first standard gas cylinder, a target gas cylinder and a gas adding pipeline, and a booster pump is arranged on the gas adding pipeline; the two ends of the gas adding pipeline are connected with the first standard gas cylinder and the target gas cylinder correspondingly, and the gas adding pipeline is used for adding gas in the first standard gas cylinder into the target gas cylinder. The gasdriving module is connected with the booster pump through a driving gas pipeline; a pressure detection assembly, a pressure adjusting assembly, a temperature detection assembly and a temperature adjusting mechanism are arranged on the gas adding pipeline, the pressure detection assembly is used for collecting a first gas pressure signal in the gas adding pipeline and sending the first gas pressure signal to the control module, and the temperature detection assembly is used for collecting a temperature signal of the gas adding pipeline and sending the temperature signal to the control module; the control module controls the pressure adjusting assembly to enable the inflation pressure change rate of the gas adding pipeline to be within a preset safety range. The control module regulates and controls the temperature of the gas adding pipeline to be within a preset temperature range.
Owner:TECH & ENG CENT FOR SPACE UTILIZATION CHINESE ACAD OF SCI

Machining device for matt cable

The invention discloses a machining device for a matt cable. The machining device comprises a sand blasting box, a centrifugal chamber and a high-pressure gas source. A sand guide pipe and a high-pressure gas pipe are arranged in the sand blasting box. The centrifugal chamber is arranged above the sand blasting box and communicated with the sand guide pipe. The high-pressure gas source is communicated with the high-pressure gas pipe. A cable inlet and a cable outlet are formed in the two sides of the sand blasting box respectively. Multiple baffles are arranged at the portion, between the cable inlet and the cable outlet, in the sand blasting box and distributed criss-cross in the cable conveying direction. One side of each baffle is provided with at least one spray gun, spray openings of the spray guns face the baffle faces, close to the conveyed cable, of the baffles, gaps allowing the cable to pass are reserved between the spray guns and the baffle faces of the baffles, each spray gun is provided with two inlets, one inlet of each spray gun is connected with the sand guide pipe, and the other inlet of each spray gun is connected with the high-pressure gas pipe. By the adoption of the machining device, the baffles are arranged criss-cross in the cable conveying direction, so that the situation that the cable swings and shakes due to blasting force in the sand blasting process, the sand blasting face is uneven, and conveyance is unstable is avoided.
Owner:蚌埠格识知识产权运营有限公司

Three-phase doubly salient motor with non-uniformly distributed stator pole widths

The invention discloses a three-phase doubly salient motor with non-uniform stator pole width distribution. The three-phase doubly salient motor comprises a stator iron core, a rotor iron core, an excitation element, an armature winding and a rotating shaft, and is characterized in that the rotor iron core is arranged inside the stator iron core, the rotating shaft is arranged inside the rotor iron core, the excitation element is arranged at the yoke part of the stator iron core, the armature winding is wound on the stator pole of the stator iron core, a rotor pole is arranged on the rotor iron core, the pole width of the stator pole is unevenly distributed, the pole width of the rotor pole is evenly distributed, the maximum pole width dmax of the stator pole is equal to the pole width of the rotor pole, the minimum pole width dmin is two thirds of the pole width of the rotor pole, the rotor iron core and the stator iron core are both of a salient pole structure, the number of the rotor poles is 4N, the pole-arc coefficient of the rotor is 0.5, the number of the stator poles is 6N, and N is a positive integer. According to the invention, approximate sine of the induction electromotive force of the armature winding of the doubly salient motor is realized, so that the doubly salient motor can adopt sine wave power supply, the torque ripple of the doubly salient motor is reduced, and the iron core loss of the motor is reduced.
Owner:ZHENGZHOU UNIVERSITY OF LIGHT INDUSTRY
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