A detection method for pcb board soldering defects based on depth information

Abstract

The invention discloses a PCB board welding defect detection method based on depth information. The method comprises the following steps: separately collecting the depth data of the welding area of ​​the PCB board to be detected and the welding area of ​​the standard PCB board; The corresponding depth images are generated respectively; the standard welding image is obtained according to the standard depth image, and the welding image to be tested is obtained according to the depth image to be measured; the standard welding image and the welding image to be tested are image registered; the welding image to be tested is marked Solder position, and judge whether the solder is out of the solder position according to the ratio calculation value of the solder position; perform image difference calculation on the registered standard welding image and the welding image to be tested to obtain a binary image; determine PCB board welding defects according to the binary image , this method can reduce the amount of data to be processed, has low requirements on lighting conditions, and can reduce the false detection rate.

Description

technical field [0001] The invention relates to the field of detection of electronic components, in particular to a method for detecting welding defects of PCB boards based on depth information. Background technique: [0002] At present, PCB board defect detection in the industry is mostly based on the two-dimensional color image information of the PCB board. The data volume in the two-dimensional color image is too large and there is a lot of useless information, and the processing speed is slow. Low, high false detection rate, by extracting the color, corner points and other features of the two-dimensional image, and then comparing with the standard board, the defects in the PCB board can be detected. Contents of the invention [0003] The purpose of the present invention is to provide a PCB board welding defect detection method based on depth information to solve the above-mentioned multiple defects caused in the prior art. [0004] A method for detecting defects in PC...

AI Technical Summary

Problems solved by technology

[0002] At present, PCB board defect detection in the industry is mostly based on the two-dimensional color image information of the PCB board. The data volume in the two-dimensional color image is too large and there is a lot of useless information, and the processing speed is slow. Low, high false detection rate, by extracting the color, corner points and other features of the two-dimensional image, and then comparing with the standard board, the defects in the PCB board can be detected

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