Heat dissipation device

A technology for heat sinks and chambers, applied in cooling/ventilation/heating transformation, etc., can solve the problems of complicated welding and assembly process, inconvenient installation and arrangement of electronic equipment, difficult piping arrangement, etc., so as to save labor costs and piping. Ease of layout, reducing the effect of assembly and soldering processes
CN109819635APending Publication Date: 2019-05-28SHENZHEN ZHIHAN THERMAL TRANSMISSION TECH CO LTD

Patent Information

Authority / Receiving Office
CN ยท China
Current Assignee / Owner
SHENZHEN ZHIHAN THERMAL TRANSMISSION TECH CO LTD
Publication Date
2019-05-28

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Abstract

The application provides a heat dissipation device, including a condenser, an evaporator, a steam pipe and a liquid pipe. The condenser is used for condensing a vapor working medium into a liquid working medium, and includes a flat pipe and a current collector. The cavity in the current collector is divided by a partition into an upper chamber and a lower chamber independent of each other. The flat pipe is bent into an upper segment and a lower segment communicated with each other. The upper segment is communicated with the upper chamber through an upper jack, the lower segment is communicatedwith the lower chamber through a lower jack, the steam pipe of the heat dissipation device is communicated with the upper chamber, and the liquid pipe of the heat dissipation device is communicated with the lower chamber, thus forming a loop. Only one current collector is arranged at one end of the condenser, which can reduce the assembling and welding processes, save the labor cost and improve the assembly efficiency. Because the cavity of the current collector is divided into an upper chamber and a lower chamber with different functions, the steam pipe and the liquid pipe can be arranged from the same end of condenser, there are fewer electronic components bypassed, and the arrangement of pipes is more convenient and flexible.
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Claims

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