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High-precision testing method for interface contact thermal resistance

A testing method, a technology of contact thermal resistance, applied in the testing field, can solve problems such as not being perfect, and achieve the effect of improving testing accuracy and high-precision testing

Active Publication Date: 2019-06-04
GUILIN UNIV OF ELECTRONIC TECH
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Problems solved by technology

In short, the above-mentioned steady-state method and unsteady-state method are mainly aimed at measuring the thermal contact resistance of materials at room temperature and not exceeding 600°C, but the thermal contact resistance under high temperature conditions has not been well established due to many key issues involved. Higher precision test method can be used for actual test

Method used

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  • High-precision testing method for interface contact thermal resistance
  • High-precision testing method for interface contact thermal resistance
  • High-precision testing method for interface contact thermal resistance

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Embodiment 1

[0033] The high-precision testing method of interface thermal resistance of the present invention, concrete steps are as follows:

[0034] The first step, the preparation of test equipment:

[0035] The upper and lower samples to be tested are processed, and the upper and lower samples are installed between the heating body and the cooling block. Between the blocks, add two heat flow meters;

[0036] The structure diagram of the testing device of the present invention is as follows: figure 1 As shown, the test device is similar to the American National Standard ASTM E1225, and further upgrades have been made on the basis of it to improve the test accuracy. For example, to prevent heat loss, a multi-layer heat protection screen is added, and the entire test area is placed in a vacuum chamber. The contact interface temperature of the material sample pair to be tested is measured by a thermal imaging system. figure 1 Sample 1 in the formula corresponds to the lower sample to b...

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Abstract

The invention discloses a high-precision testing method for interface contact thermal resistance, which belongs to the technical field of testing. The testing method of the invention uses an advancednon-contact thermal imaging technology to perform average processing of multiple data points. Compared with the existing interface extrapolation or random value selection method for an interface temperature difference, the testing method can obtain the interface temperature difference in a more accurate mode, the interface contact thermal resistance testing precision by adopting the thermal imaging technology is further improved, high-precision testing on high-temperature, transient and micro-nano-scale interface contact thermal resistance can be realized, and interface contact thermal resistance testing at a temperature range of normal temperature to 2700 DEG C can be realized.

Description

technical field [0001] The invention belongs to the technical field of testing, and in particular relates to a testing method for interface contact thermal resistance. Background technique [0002] Contact thermal resistance is a parameter affected by many factors such as material properties, mechanical properties, surface morphology, contact pressure, temperature, and gap material. According to whether the experimental heat flow is stable, the contact thermal resistance measurement methods are generally divided into transient method and steady state method. Transient method is also a commonly used experimental measurement method of thermal contact resistance, which mainly includes laser photothermal measurement method, thermal imaging method, "flash" flash method, laser photoacoustic method, etc., and laser photothermal measurement method also includes modulated light Thermal method and thermal scanning method, modulated photothermal method is divided into photothermal amp...

Claims

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Application Information

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IPC IPC(8): G01N25/20
Inventor 张平李强宣益民马伟陈孟君黄勇史波杨道国
Owner GUILIN UNIV OF ELECTRONIC TECH
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