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Edge compensation system, wafer carrier system and wafer mounting method

An edge compensation and wafer technology, which is applied in photolithographic process exposure devices, electrical components, semiconductor/solid-state device manufacturing, etc., can solve the problems of increased wear on the edge of the workbench, increased scrap rate, and impact on wafer flatness, etc.

Inactive Publication Date: 2019-06-04
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] As the number of processed wafers increases, the wear on the edge of the worktable is intensified, which further affects the flatness of the wafers, causing troubles to the subsequent processing and increasing the scrap rate

Method used

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  • Edge compensation system, wafer carrier system and wafer mounting method
  • Edge compensation system, wafer carrier system and wafer mounting method
  • Edge compensation system, wafer carrier system and wafer mounting method

Examples

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Embodiment Construction

[0061]In the following, only some exemplary embodiments are briefly described. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the drawings and descriptions are to be regarded as illustrative in nature and not restrictive.

[0062] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial" , "radial", "circumferential" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or imp...

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PUM

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Abstract

The present invention relates to an edge compensation system for a work table for carrying a wafer. The system comprises a support device for supporting and lifting an edge portion of the work table,an actuating device which is located under the support device and is used for actuating the support device to lift the edge portion of the work table, a control device for controlling an actuation amount of the actuating device such that the edge portion of the work table is lifted in a controller manner to compensate the abrasion of the edge portion of the work table by an edge of the wafer. According to the invention, the height of a worn carrier can be compensated, the flatness and stability of an edge of a silicon wafer during exposure are improved, the pattern defocusing and poor performance of layer alignment after lithography are avoided, and the life of the carrier and the product yield are improved. The invention further relates to a wafer carrier system and a method for mountinga wafer on the work table.

Description

technical field [0001] The invention relates to the application of semiconductor photolithography technology, in particular to an edge compensation system for a workbench carrying a wafer, a wafer carrier system and a method for installing the wafer on the workbench. Background technique [0002] In the manufacturing process of semiconductor chips, an exposure machine is usually used to expose a wafer placed on a workbench, so as to form desired patterns on the wafer. [0003] Referring now to FIG. 1 , the problems existing in the prior art when wafers are placed on the workbench of an exposure machine will be described. [0004] Figure 1a to Figure 1c The process of placing a wafer on the workbench of an exposure machine in the prior art is shown. [0005] As shown in the figure, the exposure machine includes a stage 110, a workbench 120 above the stage 110, and a lifting part (PIN) 130 located under the stage 110. The lifting part 130 can pass through the stage 110 and t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/68G03F7/20
Inventor 不公告发明人
Owner CHANGXIN MEMORY TECH INC