Packaging body for reducing lamination packaging structure of communication chip

Abstract

The invention discloses a packaging body for reducing a lamination packaging structure of a communication chip, which relates to the technical field of packaging bodies. In order to solve the problemthat the heat dissipation effects of the existing communication chip packaging body are limited, an external heat dissipation fan is often required to be connected to ensure long-time operation. The upper surface of an upper insulating case is provided with a model label, one side of the upper insulating case is provided with an input pin, the other side of the upper insulating case is provided with an output pin, the outer walls of the input pin and the output pin are both provided with metal coatings; the outer walls of two sides of the upper insulating case are provided with pin grooves, one end of the input pin and one end of the output pin pass to extend to the inner parts of the pin grooves, a lower insulating case is arranged below the upper insulating case, a welding plate is arranged on the lower surface of the lower insulating case, the welding plate is internally provided with a connection notch, and a welding ball is arranged below the connection notch.

Description

technical field [0001] The invention relates to the technical field of packaging bodies, in particular to a packaging body used for reducing stacked packaging structures of communication chips. Background technique [0002] The so-called "packaging technology" is a technology of packaging integrated circuits with insulating plastic or ceramic materials. Taking the CPU as an example, the actual size and appearance are not the size and appearance of the real CPU core, but the packaged products of the CPU core and other components. Packaging technology is necessary and crucial for chips. , because the chip must be isolated from the outside world to prevent impurities in the air from corroding the chip circuit and causing electrical performance degradation. On the other hand, the packaged chip is also easier to install and transport. Since the quality of packaging technology also directly affects the performance of the chip itself and the design and manufacture of the PCB conne...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a package for communication chips with a reduced stacked packaging structure, so as to solve the problem that the heat dissipation effect of the existing communication chip packages proposed in the above background technology is limited, and an external cooling fan is often required to ensure long-term operation. The problem

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