Flip LED chip

An LED chip and flip-chip technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of flip-chip leakage and failure, and achieve the effect of improving light extraction efficiency and uniform current distribution.

Inactive Publication Date: 2019-06-07
ENRAYTEK OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, for a flip chip with an odd number of strip-shaped vias, one of the strip-shaped vias will pass through the center area where the thimble is located, that is, the thimble will be on the strip-shaped via structure. The thimble will pierce the protective layer at the Mesa table of the strip-shaped through-hole located on the front of the flip-chip, making the flip-chip leakage failure problem

Method used

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Embodiment Construction

[0029] The specific implementation manner of the present invention will be described in more detail below with reference to schematic diagrams. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0030] Such as figure 1 As shown, a flip-chip LED chip provided in this embodiment includes: a flip-chip LED chip body, an odd number of strip-shaped through holes (CT) arranged at intervals on the front side (working structure surface) of the flip-chip LED chip body , wherein one of the odd-numbered through-holes is located on the center line of the flip-chip LED chip body and runs through the center of the flip-chip LED chip body. Hole 800, the central strip-shaped through hole 800 includes: an external expan...

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Abstract

The invention discloses a flip LED chip. The chip includes a flip LED chip body, and odd number of strip-shaped through holes spaced on the front side of the flip LED chip body; one of the odd numberof the strip-shaped through holes is the center strip-shaped through hole which passes through the central axis of the flip LED chip body; the center strip-shaped through hole includes a first plug through hole, an outer expansion hole structure and a strip-shaped groove part penetrating the outer expansion hole structure and the first plug through hole; the first plug through hole is used for forming an N electrode structure; and the outer expansion hole structure includes a thimble area. Therefore, the problem of leakage failure of the flip LED chip caused by an insulation protective layer on the center strip-shaped through hole of the flip LED chip that pierced by a thimble can be solved.

Description

technical field [0001] The invention relates to the technical field of LED chip manufacturing, in particular to a flip-chip LED chip. Background technique [0002] A light emitting diode (Light Emitting Diode, LED) is a semiconductor solid-state light-emitting device, which is made using the principle of semiconductor PN junction electroluminescence. LED devices have good photoelectric properties such as low turn-on voltage, small size, fast response, good stability, long life, and no pollution. Therefore, they are widely used in outdoor and indoor lighting, backlighting, display, traffic indication and other fields. [0003] Generally speaking, LED chips are divided into two types: horizontal structure (front-mounted chip) and flip-chip structure (flip-chip); The chip is the center, and the radius is less than or equal to 50 microns). For the front-mounted chip, the thimble is on the back of the front-mounted chip. Since the back of the front-mounted chip is the substrate ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/38H01L33/46
Inventor 沈铭
Owner ENRAYTEK OPTOELECTRONICS
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