Preparation method of light-emitting panel, light-emitting panel and display device

Abstract

The invention discloses a preparation method of a light-emitting panel, the light-emitting panel and a display device; the preparation method comprises the steps that a substrate is provided; a light-emitting device is formed on the substrate; a first inorganic layer is formed on the light-emitting device, wherein the first inorganic layer comprises a flat part, a step part and an edge part; the step part comprises a first step part and a second step part; the first step part is connected with the flat part, and the second step part is connected with the edge part; the substrate and the firstinorganic layer are coated with organic materials, and patterning is carried out on the organic materials to obtain the patterned organic auxiliary layer, wherein the organic auxiliary layer is formedon the edge parts of the substrate and the first inorganic layer; an organic layer is formed on the first inorganic layer which is surrounded by the organic auxiliary layer, and the organic layer covers the flat part and the step part of the first inorganic layer; and the organic auxiliary layer is stripped off, and a second inorganic layer is formed on the edge parts of the first inorganic layerand the organic layer, so that the arrangement of a retaining wall is avoided, thereby lowering the possibility of stripping between the film layers.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a method for preparing a light-emitting panel, a light-emitting panel and a display device. Background technique [0002] In recent years, organic light emitting devices (Organic Light Emitting Diode, OLED) have become the most promising new display devices in recent years due to their advantages such as self-luminescence, all-solid-state, and high contrast. With the continuous improvement of users' requirements on the quality of display devices, packaging technology is particularly critical. [0003] In the prior art, in order to prevent water and oxygen from penetrating from the side of the display device, a hydrophobic retaining wall or a raised retaining wall is generally arranged between two inorganic packaging layers, so that water and oxygen cannot penetrate into the device, but because the retaining wall is If it is placed between two inorganic encapsulation l...

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Problems solved by technology

[0003] In the prior art, in order to prevent water and oxygen from infiltrating from the side of the display device, a hydrophobic retaining wall or a raised retaining wall is generally arranged between two inorganic packaging layers, so that water and oxygen cannot penetrate into the device, but because the retaining wall is If it is installed between two inorganic encapsulation layers, the upper and lower inorganic encapsulation layers cannot be completely bonded. Therefore, the display device is exposed to high temperature and high humidity environment, and the characteristics of the film layer change, resulting in easy peeling between the film layers.

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