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High-heat-dissipation bus duct structure

A technology of busway and high heat dissipation, which is applied in the direction of cooling busbar device and fully enclosed busbar device, which can solve the problems of high manufacturing cost, poor heat dissipation performance, unreliable conductive connection, etc.

Pending Publication Date: 2019-06-14
马克威尔(广州)电气有限公司 +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Various bus ducts are often used in power transmission and distribution in the power supply system. The existing bus ducts generally include a housing and a multi-phase conductor covered with insulating materials in the housing. The existing bus ducts This kind of busway structure, because the conductor is completely covered by insulating material, so the heat dissipation area between the conductor and the shell is small, it is not conducive to the overall heat dissipation during use, and the heat dissipation performance is poor. In addition, the shell of the busway and the conductor The monolithic design makes it cumbersome to install, unreliable for conductive connections, and expensive to manufacture

Method used

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  • High-heat-dissipation bus duct structure

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Embodiment Construction

[0015] The high heat dissipation busway structure of the present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

[0016] As shown in the figure, the high heat dissipation busway structure of the present invention includes a casing 1 with a convex cross-sectional shape and a cover plate 2 installed at the bottom opening of the casing. Radiation teeth can be arranged outside the casing. The middle part of the casing 1 There is a U-shaped card slot 7 formed by two plates extending from the top to the bottom of the cavity. A grounding conductor 8 is placed in the U-shaped card slot 7. The inner cavity of the upper half of the housing 1 (the top protruding part in the convex structure) ) is divided into two left and right housing cavities by the U-shaped card slot 7 from the middle, and a U-shaped upper insulator 3 is respectively placed in the left and right two cavities, and the inner cavity of the lower ...

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Abstract

The invention discloses a high-heat-dissipation bus duct structure. The high-heat-dissipation bus duct structure comprises a shell and a cover plate, wherein the shell is of a convex-shaped cross-section shape structure; the middle of an inner cavity in the upper half part of the shell is divided into a left containing cavity and a right containing cavity from the middle, and a U-shaped upper insulating part is arranged in each of the left containing cavity and the right containing cavity separately; two U-shaped lower insulating parts which are pressed against the edge of the shell are arranged in an inner cavity of the lower half part of the shell, and a U-shaped containing groove is formed in each of the upper insulating part and the lower insulating part separately; a plurality of insulating supports arranged in the longitudinal direction of the shell are arranged on the cover plate; and each insulating support can be supported at the lower end of each phase conductor. By the adoption of the structure, the four-phase U-shaped conductor scan be directly pressed against the side wall of the shell through the insulating parts, and the four-phase conductors can directly dissipate heat directly, and therefore the heat dissipation capacity is greatly improved; and by virtue of an additionally arranged convex structure, the stable stress is also ensured, the reliability of connection is improved, the overall structural design is reasonable, the connection and installation are simple, the plugging is convenient, and the conductive reliability is very high.

Description

technical field [0001] The invention relates to a component for power transmission and distribution in a power supply system, in particular to a high heat dissipation bus duct structure. Background technique [0002] Various bus ducts are often used in power transmission and distribution in the power supply system. The existing bus ducts generally include the shell and the multi-phase conductors covered by insulating materials in the shell. The existing bus ducts This kind of busway structure, because the conductor is completely covered by insulating material, the heat dissipation area between the conductor and the shell is small, which is not conducive to the overall heat dissipation during use, and the heat dissipation performance is poor. In addition, the shell of the busway and the conductor The integral design makes installation troublesome, conductive connection unreliable, and manufacturing cost high. Contents of the invention [0003] The technical problem to be s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02G5/06H02G5/10
Inventor 王署斌
Owner 马克威尔(广州)电气有限公司
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