Manufacturing method of device structure
A manufacturing method and structure technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as poor coverage, difficulty in ensuring barrier properties, insufficient coverage of inorganic films, etc., to achieve improved barrier properties, The effect of improving airtightness
Active Publication Date: 2021-06-29
ULVAC INC
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Problems solved by technology
[0005] However, the coverage characteristics (step (step difference) coverage) of inorganic films that have barrier properties to water vapor and the like are relatively low, and if there are irregularities on the surface of the substrate with the device layer, the inorganic films cannot sufficiently cover the irregularities.
For example, poor coverage may occur where the boundary of the unevenness formed on the substrate surface is not covered by the inorganic film.
If such poor coverage of the inorganic film occurs, it will be difficult to ensure sufficient barrier properties because moisture intrusion from the part where the poor coverage occurs cannot be prevented.
Method used
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[0033] Next, an apparatus for manufacturing an element structure according to a first embodiment of the present invention will be described with reference to the drawings.
[0034] figure 1 It is a schematic diagram showing the manufacturing apparatus in the manufacturing method of the element structure according to this embodiment. figure 2 It is a schematic schematic diagram which shows the resin film formation part concerning this embodiment. image 3 is a schematic diagram showing a localized processing unit of the manufacturing device of the element structure according to the present embodiment. figure 1 In , reference numeral 1000 is a manufacturing device of an element structure.
[0035] As will be described later, the device structure manufacturing device 1000 according to this embodiment manufactures element structures such as organic EL elements. Such as figure 1 As shown, the manufacturing apparatus 1000 has a first layer forming part 201, a resin film forming...
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The method for producing an element structure of the present invention includes: a resin material forming step of forming a resin material made of an organic substance on a substrate having unevenness so that at least the periphery of the convex portion is thicker than the flat portion; and a resin material etching step, A part of the resin material at the periphery of the convex portion remains, and the resin material in the flat portion is removed. In the resin material etching step, a change in a specific condition among the conditions for performing the etching treatment on the resin material is detected, and the detected detection result is used as the end point of the etching treatment.
Description
technical field [0001] The present invention relates to a method of manufacturing an element structure, and more particularly, to an appropriate technique for an element structure having a laminated structure that protects devices, etc. from oxygen, moisture, and the like, and a manufacturing method using the element structure . [0002] This application claims priority based on Patent Application No. 2017-030316 filed in Japan on February 21, 2017, and uses the content thereof here. Background technique [0003] An organic EL (Electro Luminescence, electroluminescence) element etc. are known as an element containing the compound which has the property which is easily damaged by moisture, oxygen, etc. and deteriorates. With regard to such devices, attempts have been made to suppress intrusion of moisture or the like into the device by forming a laminated structure in which a layer containing a compound and a protective layer covering the layer are laminated. For example, P...
Claims
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IPC IPC(8): H05B33/10H01L21/3065H01L51/50H05B33/04
CPCH01L21/3065H05B33/04H05B33/10H10K71/00H01L21/31116
Inventor 清健介青代信高桥明久矢岛贵浩加藤裕子
Owner ULVAC INC