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Hot-film wind speed sensing unit and sensor based on HTCC technology and preparation method of sensing unit

A wind speed sensor and wind speed sensing technology, applied in the direction of using thermal variables to measure fluid speed, etc., can solve the problems of being susceptible to wind direction interference, low measurement accuracy of wind speed sensors, etc., to solve the problem of unstable airflow, little influence of wind direction, and easy integration Effect

Inactive Publication Date: 2019-06-18
NO 49 INST CHINESE ELECTRONICS SCI & TECH GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The present invention aims to solve the problems of the existing wind speed sensor, such as low measurement accuracy and susceptibility to wind direction interference, and now provides a hot-film wind speed sensing unit based on HTCC technology, a sensor and a preparation method of the sensing unit

Method used

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  • Hot-film wind speed sensing unit and sensor based on HTCC technology and preparation method of sensing unit

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specific Embodiment approach 1

[0043] Specific implementation mode one: refer to Figure 1 to Figure 3 Specifically explain this embodiment, the hot-film wind speed sensing unit based on HTCC (high temperature co-fired ceramics) process described in this embodiment includes: two ceramic substrates and five resistors, the two ceramic substrates are respectively the upper The substrate 2 and the lower substrate 1, the five resistors are: one heating resistor 3, two control resistors 4 and two temperature sensing resistors 5;

[0044] The two substrates are stacked and fixed, and the five resistors are fixed on the upper surface of the upper substrate 2 along a straight line,

[0045] The two control resistors 4 are distributed on both sides of the heating resistor 3 in a mirror image structure, and the two temperature sensing resistors 5 are distributed outside the two control resistors 4 in a mirror image structure.

[0046] The junction of the two substrates is provided with a diversion groove 6 with openi...

specific Embodiment approach 2

[0050] Specific implementation mode two: refer to Figure 4 Specifically explain this embodiment, the hot-film wind speed sensor based on HTCC technology described in this embodiment includes: two substrates and 2n+1 resistors, 2n+1 resistors include: a heating resistor 3 and n pairs of resistors Yes, each pair of resistors includes a control resistor 4 and a temperature sensing resistor 5, n is a positive integer;

[0051] In this embodiment, n=8, under the condition that there are 8 pairs of resistance pairs and the upper surface of the upper substrate 2 is a rectangular structure, the structure of the sensor is as follows:

[0052] The two substrates are stacked and fixed, and the 17 resistors are all fixed on the upper surface of the upper substrate 2,

[0053] The heating resistor 3 is located at the center of the upper surface of the upper substrate 2, and 8 pairs of resistors are distributed around the heating resistor 3. The 8 pairs of resistors are paired in pairs to...

specific Embodiment approach 3

[0059] Specific embodiment three: this embodiment is the preparation method of the sensing unit described in specific embodiment one, and the specific preparation method is as follows:

[0060] Use a punching machine to make via holes 7 on the two substrates respectively,

[0061] Fill the via holes 7 of the upper substrate 2 with platinum paste by screen printing, and print five resistors on the upper surface of the upper substrate 2 respectively,

[0062] Fill the via holes 7 of the lower substrate 1 with platinum paste, and print a lead-out 71 at the outlet of each via hole 7 on the lower surface of the lower substrate 1,

[0063] Use carbon paste to print flow guide lines on the upper surface of the lower substrate 1, wherein the thickness of the carbon paste is 20 μm to 100 μm,

[0064] Lay the two substrates together so that the arrangement direction of the five resistors is consistent with the direction of the current guide line, and the via holes 7 of the upper substr...

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Abstract

The invention provides a hot-film wind speed sensing unit and sensor based on HTCC technology and a preparation method of the sensing unit, relates to the technical field of a wind speed sensor, and is to solve the problem that an existing wind speed sensor is low in measurement accuracy and is vulnerable to disturbance of wind direction. Through the principle of hot-film wind velocity measurement, gas flow velocity is measured by a sensitive element with heating current placed in a flow field; through multidirectional arrangement of chips, influence of wind direction on accurate measurement of wind speed is eliminated; a single chip is arranged in different directions, and the influence of wind direction on the accurate measurement of wind speed is eliminated by measuring data at different positions, thereby improving measurement accuracy; and by adding an air flow channel structure on the bottom, the problem of unsteady flow during dynamic wind measurement process is solved, and sensor measurement accuracy is improved. The method is suitable for preparing the hot-film wind speed sensor.

Description

technical field [0001] The invention belongs to the technical field of wind speed sensors. Background technique [0002] As an important parameter of meteorological detection, wind speed is inseparable from people's daily production and life. It is widely used in important scientific research, production and living fields such as aerospace, scientific experiments, modern agriculture and meteorological science. With the rapid development of industrial automation, people's requirements for the measurement of wind speed and air volume are also increasing. The development of wind speed sensors with high measurement accuracy, miniaturization and integration has become the development trend of wind speed sensors in the future. [0003] According to the different working principles of wind speed measurement, wind speed sensors can be divided into mechanical, dynamic pressure, ultrasonic and thermal. [0004] The mechanical type is mainly the wind cup type. This kind of sensor has...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01P5/12
Inventor 秦浩王洋洋郑丽刘志远金建东
Owner NO 49 INST CHINESE ELECTRONICS SCI & TECH GRP
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