Spoof surface plasmon transmission line based on Delta Stubs structure

Abstract

The invention relates to the technical field of electronic devices, in particular to a spoof surface plasmon transmission line based on a Delta Stubs structure. The transmission line mainly comprisesa transmission line, wherein the transmission line structure comprises two layers, wherein the upper layer is a metal conduction band, and the lower layer is a substrate; the metal conduction band isof a groove structure, and the depth of the groove determines the degree of color; two arms on the inner side of the groove are provided with triangular open line ports respectively; the groove structures are divided according to a preset proportion between the ports and the connecting points of the groove structures; and adjacent triangular open lines are not intersected. The triangular opening lines are arranged on the inner walls of the two sides of the SSP-TL respectively, so that the length of the wavelength transmission line of each groove arm is reduced, and the dimensional structure ofthe SSP-TL is reduced, and the miniaturization of the SSP-TL is realized; and meanwhile, the triangular open lines are simple in structure and can be realized by a simple process, so that the spoof surface plasmon transmission line is beneficial to popularization and application.

Description

technical field [0001] The invention relates to the technical field of electronic devices, in particular to an artificial surface plasmon transmission line based on a Delta Stubs structure. Background technique [0002] Artificial surface plasmon transmission line (Spoof Surface Plasmon Transmission Line, SSP-TL) is widely used in microwave circuits, such as filters, leaky wave antennas, power dividers, etc. The SSP-TL with the traditional unit structure is composed of a grooved metal conduction band and a substrate substrate, which has weak control ability to the electromagnetic field. Usually, the way to increase the dispersion and enhance the binding ability of the electromagnetic field is to increase the depth of the groove, but because the groove The depth of the groove is limited, and a substantial increase in the depth of the groove can only be achieved by increasing the height of the groove arm, which will inevitably increase the size of the SSP-TL. Contents of the...

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Problems solved by technology

The SSP-TL with the traditional unit structure is composed of a grooved metal conduction band and a substrate substrate, which has weak control ability to the electromagnetic field. Usually, the way to increase the dispersion and enhance the binding ability of the electromagnetic field is to increase the depth of the groove, but because the groove The depth of the groove is limited, and a substantial increase in the depth of the groove can only be achieved by increasing the height of the groove arm, but it is bound to increase the size of the SSP-TL

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