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Coil preparation method and coil

A technology of coils and copper coils, which is applied in the field of electroplating copper, can solve problems such as inability to prepare high-performance coils, and achieve the effect of avoiding short circuits between coils

Active Publication Date: 2020-06-30
SUZHOU SHINHAO MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of this application is to provide a coil preparation method to solve the technical problem that existing coil preparation methods cannot prepare coils with excellent performance of narrow line width, narrow line spacing, and high thickness

Method used

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  • Coil preparation method and coil

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Effect test

preparation example Construction

[0021] An embodiment of the present application provides a method for preparing a coil, the method is based on a pretreated substrate, the substrate includes a substrate main body and a coil unit, the lower end surface of the coil unit is fixed on the upper end surface of the substrate main body, the The coil unit includes a copper coil made of copper wire, and a photoresist is filled between two adjacent turns of the copper wire. The method includes the following steps:

[0022] The first electroplating: using the first electroplating solution to perform the first copper plating on the copper coil;

[0023] Removing the photoresist: using a photoresist cleaning solution to remove the photoresist, exposing the copper layer on the surface of the substrate body below the photoresist;

[0024] Removing the bottom copper: using a copper corrosion solution to remove the copper layer, exposing the nickel-chromium alloy layer below the copper layer;

[0025] Removing the nickel-chro...

Embodiment 1

[0033] A coil preparation method, the method is based on a pretreated substrate, the substrate includes a substrate body and a coil unit, the lower end surface of the coil unit is fixed on the upper end surface of the substrate body, and the coil unit includes a copper coil wound by copper wire The photoresist is filled between two adjacent turns of copper wires, the width of the copper coil is 80 microns, the width of the photoresist is 20 microns, and the height of the photoresist is 70 microns higher than the height of the copper coil, the method comprises the following steps:

[0034] The first electroplating: use the first electroplating solution to carry out the first copper plating on the copper coil, the current density is 5ASD, the stirring speed of the first electroplating solution is 100RMP, and a copper wall of 60 microns is obtained;

[0035] Photoresist removal: Soak the coil unit after the first electroplating in an acetone solution, and ultrasonically clean it f...

Embodiment 2

[0045] A coil preparation method, the method is based on a pretreated substrate, the substrate includes a substrate body and a coil unit, the lower end surface of the coil unit is fixed on the upper end surface of the substrate body, and the coil unit includes a copper coil wound by copper wire The photoresist is filled between two adjacent turns of copper wires, the width of the copper coil is 80 microns, the width of the photoresist is 20 microns, and the height of the photoresist is 60 microns higher than the height of the copper coil, the method comprises the following steps:

[0046] The first electroplating: use the first electroplating solution to carry out the first copper plating on the copper coil, the current density is 10ASD, the stirring speed of the first electroplating solution is 25RMP, and a copper wall of 50 microns is obtained;

[0047] Photoresist removal: Soak the coil unit after the first electroplating in an acetone solution, and ultrasonically clean it f...

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Abstract

The invention discloses a coil and a preparation method of the coil. The method is based on a pretreated substrate. The substrate comprises a substrate main body and a coil unit, wherein the lower endsurface of the coil unit is fixed to the upper end surface of the substrate main body; the coil unit comprises copper coils formed by winding copper wires; and a photoresist is filled between the twoadjacent copper coils. The method comprises the following steps of: carrying out the first-time electroplating, to be specific, carrying out the first-time copper plating on the copper coils by usinga first electroplating solution; removing the photoresist, to be specific, removing the photoresist by using photoresist cleaning liquid to expose a metal layer on the surface of the substrate main body below the photoresist; removing base copper, to be specific, removing a metallic copper layer by using copper corrosive liquid to expose a nichrome layer below the copper layer; removing the nichrome layer, to be specific, removing the nichrome layer by using nichrome corrosive liquid; and carrying out the second-time electroplating, to be specific, carrying out the second-time copper platingon the copper coils by using a second electroplating solution, thereby completing the preparation. The preparation method solves the technical problems that an existing coil preparation method cannotprepare the coils which have excellent performances, narrow wire spacing and high thickness.

Description

technical field [0001] The present application relates to the field of electroplating copper, in particular, to a method for preparing a coil and the coil. Background technique [0002] With the gradual development of electronic components, higher requirements are put forward for their processing technology. Especially for the coils in passive components, the height of the coil is large, usually greater than 100 microns, and the line width / line spacing of the coil is extremely small, usually less than 30 microns / 30 microns. This kind of coil cannot be exposed-developed-etched. way to prepare. However, using the semi-additive method to prepare coils also has the problem of difficulty in exposure and development. The photoresist is too thick, the exposure is poor, and the problems of dirty development cannot be overcome. Even if the traditional semi-additive method is reluctantly used to prepare the coil, the electroplating process is used to increase the height of the induc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38C25D5/02C25D5/10C25D7/06
Inventor 张芸赵威董培培张星星王靖
Owner SUZHOU SHINHAO MATERIALS