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Glue applying method for two-component glue

A two-component, glue technology, used in work accessories, stone processing equipment, manufacturing tools, etc., can solve the problem of inconvenient weighing of two-component glue, and achieve the effect of automatic operation, saving glue consumption and simple operation.

Active Publication Date: 2019-06-28
GCL POLY ENERGY HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Based on this, it is necessary to provide a sizing method for two-component glue to solve the problem of inconvenient weighing of two-component glue

Method used

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  • Glue applying method for two-component glue

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Adopt the sizing mode of screen printing of the present invention:

[0048] 1. Use a dust-free cloth dipped in alcohol to clean the sizing surface of the crystal silicon rod and the sizing surface of the liner, and dry it. Two stencils with a porosity of 25% are respectively hooped on the sizing surface of the crystal silicon rod and the liner.

[0049] 2. Take 15g of component A, put it on the crystal silicon rod sizing screen, apply it evenly on the screen with a scraper, remove the screen to complete the printing of crystal silicon rods. Take 15g of component B, put it on the sizing screen of the lining board, apply it evenly on the screen with a scraper, remove the screen to complete the printing glue of the lining board.

[0050] 3. Stick the two sizing surfaces tightly and shake slightly left and right 5 times to ensure that the adhesive and curing agent are fully mixed, and at the same time discharge the air bubbles between the adhesive layers.

[0051] 4. Posi...

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PUM

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Abstract

The invention relates to a glue applying method for two-component glue. The two-component glue consists of an A component and a B component. The method comprises the following steps that a screen printing manner is adopted, and the A component is printed on the first glue applying surface through a first printing mesh plate; a screen printing manner is adopted, and the B component is printed on the second glue applying surface through a second printing mesh plate; and the ratio of the hole forming rate of the first printing mesh plate and the second printing mesh plate is within the use weightratio of the A component and the B component, and the first glue applying surface with the A component printed is stuck to the second glue applying surface with the B component printed. According tothe glue applying method for the two-component glue, the screen printing is adopted, the control of the weight ratio of the use of the A component and the B component is controlled, the glue applyingmethod does not need the glue preparing operation such as the weighing and mixing, the problems that the glue weighing is difficult, the stirring is not prone to fully mixing, and the coating is uneven in a two-component glue applying process are solved by one step, the waste of the glue in the process of the glue taking can be avoided, and the 30-45% of the glue use amount is saved.

Description

technical field [0001] The invention relates to the field of photovoltaic cell manufacturing, in particular to a method for sizing two-component glue. Background technique [0002] Wafer cutting is an important part of the photovoltaic cell manufacturing process. This process is a process in which one or more crystalline silicon rods are bonded to the tooling crystal support and the lining board, and then cut into thousands of thin silicon wafers by a wire saw. , These silicon wafers are the silicon substrates used in the manufacture of photovoltaic cells. [0003] At present, the adhesives used for silicon wafer cutting are mainly divided into two types: 1. Two-component glue, represented by epoxy AB glue; 2. One-component glue, mainly acrylic anaerobic adhesive. When using two-component glue, the adhesive (component A) and curing agent (component B) must be mixed evenly in a certain proportion and then applied to the bonding surface. There is a requirement for operating ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D7/00
Inventor 吉鑫阮文娟张方圆
Owner GCL POLY ENERGY HLDG