A pick-and-place device for integrated circuit materials

Abstract

The invention relates to the technical field of picking and placing materials, and discloses an integrated circuit material picking and placing device, which includes a gripper module, a first track arranged along the horizontal direction, and a device for driving the gripper module to slide linearly along the first track. The first drive mechanism, the gripper module is used to grab materials, and the second drive mechanism drives each grab mechanism to slide linearly along the second track, so as to change the relative distance between each grab mechanism according to the placement distance of materials so as to be accurate To quickly grab materials, further, each grabbing mechanism includes two grabbing units located on both sides of the second track, each grabbing unit can be lifted up and down driven by the lifting mechanism to meet the needs of material flow grabbing and placing , Moreover, the two grabbing units of the same grabbing mechanism can slide synchronously, thereby improving the spacing adjustment efficiency between each grabbing unit, thereby improving the material circulation speed and production efficiency, ensuring the adjustment accuracy, and simplifying the structure at the same time set up.

Description

technical field [0001] The invention relates to the technical field of picking and placing materials, in particular to an integrated circuit material picking and placing device. Background technique [0002] At present, the pick-and-place process of materials is very common in the production and movement of various small regular materials such as IC chips, tablets, and hardware. Placed in another location, such as semiconductor chips often need to be grabbed from a matrix tray of one specification and placed accurately on a matrix tray of another specification; Pick and place the material tray of another specification into the material slot of another specification for packaging; another example is in the production and packaging process of hardware, the material pick and place transfer will also be used. [0003] During the production and processing of various small regular materials, a lot of work is required for pick-and-place handling. Currently, the gripper devices use...

AI Technical Summary

Problems solved by technology

[0003] During the production and processing of various small regular materials, a lot of work is required for pick-and-place handling. Currently, the gripper devices used more often can only grab one at a time, and some can grab multiple objects at a time, but they cannot be adjusted. spacing between objects

At present, the requirements for UPH (units per hour) value in the field of integrated circuit testing are constantly being refreshed. The efficiency of traditional manual operations is too low, and the general single gripper is far from meeting the needs of use. Therefore, multi-gripper equipment is used. However, in the process of testing, packaging, marking, etc., the chips must be directly circulated on different trays and workstations. The spacing between different trays and chips during work is different. Each of the existing multi-handle equipment Each grabbing unit is independently controlled and adjusted separately. The corresponding equipment structure is complex and bulky. The efficiency of each grabbing unit is low when adjusting the relative distance, and the adjustment accuracy is not high, which reduces the material flow speed and production efficiency.

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