Electrostatic chuck, film forming apparatus, substrate holding and separating method, film forming method and manufacturing method of electronic device
A technology of electrostatic chuck and substrate holding part, which is applied in the direction of ion implantation plating, semiconductor/solid-state device manufacturing, circuit, etc., which can solve the problem of reducing the precision of evaporation, achieve the effect of stabilizing the separation start position and reducing the impact
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[0028] Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples are for illustrative purposes only and show preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. In addition, the hardware structure and software structure, processing flow, manufacturing conditions, dimensions, materials, shapes, etc. of the devices described below are not intended to limit the scope of the present invention unless otherwise specified.
[0029] The present invention can be suitably applied to an apparatus for forming a patterned thin film (material layer) on the surface of a substrate by vacuum evaporation. As the material of the substrate, any material such as glass, a thin film of a polymer material, or metal can be selected, and as the vapor deposition material, any material such as an organic material or ...
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