Substrate inspection device and substrate inspection method

A substrate inspection and substrate technology, applied in measurement devices, optical devices, instruments, etc., can solve the problems of thickness measurement errors, difficulty in realizing OCT miniaturization, etc., and achieve the effect of reducing measurement errors and shortening the time required for measurement

Active Publication Date: 2021-03-16
株式会社高迎科技
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Problems solved by technology

However, when the thickness inspection of the coating film is performed using OCT, the saturation phenomenon of light occurs due to the reflection of the reference mirror, and errors in thickness measurement occur.
In addition, it is difficult to miniaturize the OCT due to the components such as the reference mirror, the window glass, and the beam splitter of the OCT.

Method used

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  • Substrate inspection device and substrate inspection method
  • Substrate inspection device and substrate inspection method
  • Substrate inspection device and substrate inspection method

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Embodiment Construction

[0039] Various embodiments described herein are given for the purpose of clearly explaining the technical idea of ​​the present disclosure, and are not intended to be limited to specific embodiments. The technical idea of ​​the present disclosure includes various modifications (modifications), equivalents (equivalents), alternatives (alternatives) of the embodiments described herein, and embodiments in which all or a part of the embodiments are selectively combined. In addition, the scope of rights of the technical thought of this disclosure is not limited to the various examples presented below or the specific description thereof.

[0040] Including technical or scientific terms, as long as they are not defined differently, the terms used herein may have the meanings generally understood by those of ordinary skill in the art to which the present disclosure belongs.

[0041] Expressions such as "comprising", "may include", "have", "may have", "has", "may have" etc. as used her...

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Abstract

The present disclosure proposes a substrate inspection device. The substrate inspection apparatus of the present disclosure may include: a light source that irradiates laser light toward a coating film coated on an area on a substrate; an optical sensor that obtains a reference generated by the laser light being reflected by the surface of the coating film light interference data caused by interference between light and measurement light scattered by the laser light through the coating film; and a processor that derives the coating corresponding to the one region based on the light interference data. The thickness of the film.

Description

technical field [0001] The present disclosure relates to a substrate inspection device and a substrate inspection method. Background technique [0002] In the processing process of the substrate, the substrate may be coated in order to protect components on the substrate. Such coatings may be referred to as conformal coatings. In order to confirm whether the coating film on the substrate generated by coating is uniformly coated to a predetermined thickness, a thickness inspection of the conformal coating film may be performed. [0003] For the thickness inspection of the coating film, a two-dimensional (2Dimensional) fluorescent photographic inspection can be performed. However, the two-dimensional image shooting inspection can only perform a qualitative inspection of the thickness of the coating film, and cannot measure the accurate thickness value of the coating film. In addition, when the coating film is thin (for example: about 30 μm) in the two-dimensional imaging in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/06
CPCG01B11/0675G01B11/0658G01B11/0625G01B11/0683
Inventor 洪映周洪德和金玟奎崔桢熏
Owner 株式会社高迎科技
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