Hybrid MMC Thermal Stress Unevenness Suppression Method Based on Active Bypass and Symmetrical Modulation
A hybrid, thermal stress technology, applied to output power conversion devices, electrical components, AC power input conversion to DC power output, etc., to achieve the effect of reducing thermal unevenness
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[0027] In order to describe the method proposed by the present invention more specifically and clearly, the technical solution of the present invention will be described in detail below with reference to the drawings and specific cases.
[0028] Such as figure 1 As shown, the hybrid modular multilevel converter topology is composed of three-phase six bridge arms, and each bridge arm is composed of N HB Half-bridge sub-modules, N FB A full bridge sub-module and a bridge arm reactor are connected in series. The half-bridge sub-module is composed of two IGBTs, anti-parallel diodes, and DC capacitors. The upper tube IGBTs and diodes use T 1 And D 1 Indicates that the down tube IGBT and diode are respectively T 2 And D 2 Said. The full-bridge sub-module is composed of four IGBTs and anti-parallel diodes. The upper and lower IGBTs and diodes of the left bridge arm use T 1 , D 1 , T 2 , D 2 Indicates that the upper and lower tube IGBT and diode of the other bridge arm use T 3 , D 3 , ...
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