High frequency board manufacturing method
A manufacturing method and high-frequency board technology, applied in the field of circuit board manufacturing, can solve problems such as open circuit, easy deformation of PTFE daughter board, short circuit, etc., to avoid open circuit or short circuit, ensure stability and integrity, and prevent dust contamination. Effect
Active Publication Date: 2020-08-18
SHENZHEN KINWONG ELECTRONICS
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Problems solved by technology
[0004] The purpose of the present invention is to provide a high-frequency board manufacturing method, which aims to solve the problem of poor stability and integrity of signal transmission caused by the easy deformation of the PTFE sub-board during the manufacturing process of the existing high-frequency board, and the external PTFE sub-board. The problem of open circuit or short circuit in the subsequent production circuit caused by the layer is easy to adhere to foreign matter
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[0030] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0031] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical ", "horizontal", "top", "bottom", "inner", "outer" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying Describes, but does not indicate or imply that the device or element referred to must have a specific orientation, be...
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Abstract
The invention discloses the technical field of circuit board manufacturing, and provides a high-frequency board manufacturing method. The method comprises the steps of material preparation, sub boardpreparation, lamination connection, and film tearing and formation. In the sub board preparation step, a PTFE substrate is subjected to preprocessing of the substrate, a lower base surface is subjected to browning processing to make the PTFE substrate to a PTFE sub board, wherein after the PTFE substrate is subjected to pre-processing of the PTFE substrate and before the browning processing of thelower base surface, a protection film is taken off and attached to an upper base surface; in the lamination connection step, the protection film, the PTFE sub board and an FR4 mother board are laminated to allow the PTFE sub board to be crimped with the FR4 mother board; and in the film tearing and formation step, the protection film is taken off from the PTFE sub board. The high-frequency boardmanufacturing method performs protection of the upper base surface of the PTFE substrate through the protection film so as to improve the stability and the completion of the signal transmission of a finally formed high-frequency board and avoid the condition of open-circuit or short-circuit of the circuit in the follow-up manufactured circuit.
Description
technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing a high-frequency board. Background technique [0002] High-frequency board is a special circuit board with high electromagnetic frequency, which can be used to transmit signals at high frequency, high speed and long distance. In order to save costs, traditional high-frequency boards are mostly formed by mixed pressing of PTFE daughter boards made of PTFE materials and FR4 motherboards made of at least one FR4 substrate made of FR-4 grade materials. [0003] However, in the manufacturing process of high-frequency boards formed by mixing PTFE daughter boards and FR4 mother boards, the softer PTFE daughter boards are often prone to deformation caused by friction and collision during the pressing process, thus affecting the final high-frequency board. The stability and integrity of the signal transmission of the frequency board have a s...
Claims
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IPC IPC(8): H05K3/46
CPCH05K3/4688
Inventor 陈晓青陈前张霞王俊
Owner SHENZHEN KINWONG ELECTRONICS