Tube socket leading wire flattening device

Abstract

The invention discloses a tube socket leading wire flattening device, and belongs to the technical field of tube socket leading wire processing equipment. The tube socket leading wire flattening device is used for improving the flattening precision and the working efficiency. According to the technical scheme, the device is characterized by comprising a rack, wherein the rack is provided with a feeding channel, the tail end of the feeding channel is provided with a material separating mechanism for separating tube sockets one by one, a flattening mechanism is arranged on the next station following the material separating mechanism, a material collecting mechanism is arranged on the next station following the flattening mechanism, and a manipulator material conveying mechanism used for conveying the tube sockets on the material separating mechanism to the flattening mechanism and conveying the tube sockets on the flattening mechanism to the material collecting mechanism is arranged between the material separating mechanism and the flattening mechanism. According to the device, the working efficiency of flattening the tube sockets is improved, and the tube sockets are flattened by adopting the automatic flattening mechanism, so that the flattening precision is higher.

Description

technical field [0001] The invention relates to the technical field of tube base lead wire processing equipment, in particular to a tube base lead wire flattening device. Background technique [0002] The term "transistor case" (more commonly known as TO) has been used for decades. Has become an industry standard to control the design and size of conductive electronic enclosures. The TO package consists of two components: a header and a cap. The stem ensures that the electrical signal is supplied to the packaged components, while the cap ensures the smooth transmission of the optical signal. Includes optical signal transmitters (such as lasers) and receivers (such as detectors). [0003] TO headers provide a mechanical base for mounting electronic and optical components such as semiconductors, laser diodes or simple circuits, while providing electrical signals to packaged components through leads. Optical components such as detectors and lasers are particularly vulnerabl...

AI Technical Summary

Problems solved by technology

[0004] like figure 1 As shown, the tube base 8 is provided with two lead wires 81 and a seat pin 82. The bottom of the lead wires 81 needs to be flattened, and some tube bases 8 need to be flattened with the lead wires 81 on them. At present, the flattening is mainly carried out manually. low work efficiency

In addition, workers will be fatigued after working for a long period of time, which will lead to a reduction in flattening accuracy, or even deviation, seriously affecting work efficiency and device accuracy

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