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A diamond cutting device

A diamond cutting and diamond technology, which is applied in the field of diamond cutting devices, can solve the problems affecting the overall quality of the diamond cutting surface, the edge chipping of the diamond cutting edge, and stress concentration, etc., so as to improve the ability to resist chipping, reduce tool marks, and ensure The effect of processing quality

Active Publication Date: 2022-03-29
CHANGCHUN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the cutting process, the sawing force is gradually increased. When the cutting is about to be completed, the sawing force will become very large, and there will be stress concentration at the sharp corner of the diamond. Chipping occurs at the edge, which seriously affects the overall quality of the diamond cutting surface

Method used

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  • A diamond cutting device
  • A diamond cutting device
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Embodiment Construction

[0019] In order to further illustrate that the design and idea provided by the present invention are effective in order to achieve the intended purpose of the invention, below in conjunction with the drawings and preferred embodiments, the specific implementation, structure, features and effects of a diamond cutting device proposed according to the present invention will be described below. , as detailed below

[0020] Such as figure 1 As shown, a diamond cutting device includes a base 100, a saw blade 200, a saw blade clamp 210, a saw blade positioning device 220, a diamond 300, a diamond pose adjustment device 310, a diamond fixing device 320, a laser 400, and a square shaft 500, Square guide rail 510, beam 600, three-way force sensor 700, pulley 800, counterweight adjustment device 900.

[0021] Such as figure 2 As shown, the saw blade positioning device 220 includes a base 221 and a V-shaped graphite block 222 .

[0022] Such as image 3 , 4 As shown, the diamond pos...

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Abstract

The invention relates to a diamond cutting device, belonging to the field of diamond cutting, including a saw blade positioning device, a diamond pose adjustment device, a square shaft, a laser, a three-way force sensor, a counterweight adjustment device and the like. Use the vertical drop of the diamond to cut the diamond vertically, which can stably realize the upward straight cutting of the easy-cut diamond crystal, and reduce the generation of knife marks; and use the laser to heat the cutting part of the diamond, and cut it with the saw blade The coupled thermal stress effect of the diamond can effectively improve the edge chipping resistance of the diamond cutting part; at the same time, the three-way force sensor can detect the change of the coupled cutting force during the cutting process, and timely feedback the control of the cutting weight and laser process parameters, so as to ensure the processing quality. Quality, improve cutting efficiency, reduce production costs.

Description

technical field [0001] The invention belongs to the field of diamond cutting, and in particular relates to a diamond cutting device. Background technique [0002] Diamond has excellent properties such as high hardness and good thermal conductivity, and is widely used in jewelry, jewelry, superhard cutting tools and other fields, but it also brings great difficulties to the high-quality and efficient processing of diamonds and increases processing costs. For the cutting of diamonds, there are various cutting methods such as cleaving, sawing, laser cutting, etc. Splitting is to use a diamond to cut a dent on the diamond to be cut along the cutting line, then put the square edge knife on the dent, and knock on the splitting knife with a suitable force, the diamond will be split along the grain direction. Two halves or more pieces. The processing efficiency of this method is low, and the processing level of the workers is very high, and sometimes even causes the diamond to bre...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/02B28D7/00B28D7/04
CPCB28D5/023B28D5/0058B28D5/0082
Inventor 石广丰付旺韩旭王淑坤韩冬冬刘思宇王雪陈敏
Owner CHANGCHUN UNIV OF SCI & TECH
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