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Package substrate and method for manufacturing package substrate

A manufacturing method and packaging technology, which can be used in semiconductor/solid-state device manufacturing, printed circuit manufacturing, electrical solid-state devices, etc., and can solve the problems of inclined conductive pillars and low viscosity of solder paste.

Active Publication Date: 2019-07-19
TATSUTA ELECTRICWIRE & CABLE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] In this way, when using solder paste to fix the conductive post to the first base material, the following problems arise: the viscosity of the solder paste is too low when the solder paste is melted, the problem that the conductive post is inclined due to its own weight, etc., and the solder paste when the solder paste melts The change of the surface tension causes the problem of the tilting of the conductive pillar

Method used

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  • Package substrate and method for manufacturing package substrate
  • Package substrate and method for manufacturing package substrate
  • Package substrate and method for manufacturing package substrate

Examples

Experimental program
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Effect test

no. 1 example ）

[0121] The first example of the manufacturing method of the package base material of the present invention is characterized in that it includes the following steps:

[0122] (1) Substrate preparation process, preparing the substrate with electrodes on the surface;

[0123] (2) Printing process, printing conductive paste containing metal powder and thermosetting resin on the above electrodes;

[0124] (3) Metal needle arrangement process, arrange metal needles on the above-mentioned conductive paste;

[0125] (4) The step of erecting the metal pins, heating the conductive paste to soften the conductive paste and then solidifying it into a cured product of the conductive paste, and erecting the metal needles on the electrodes through the cured product of the conductive paste.

[0126] Each step will be described below with reference to the drawings.

[0127] Figure 5 It is a schematic diagram of the base material preparation process included in the process of the manufacturi...

no. 2 example ）

[0167] The second example of the manufacturing method of the package base material of the present invention is characterized in that it includes the following steps:

[0168] (1) Substrate preparation process, preparing the substrate with electrodes on the surface;

[0169] (2) Conductive paste attachment process, attaching the conductive paste containing metal powder and thermosetting resin to the end of the metal needle;

[0170] (3) The process of disposing metal needles, making the conductive paste contact the electrodes, and disposing metal needles on the electrodes;

[0171] (4) Metal needle erecting process, the conductive paste is softened by heating the conductive paste and then solidified to become a cured product of the conductive paste, and the metal needle is erected on the electrode through the cured product of the conductive paste.

[0172] That is, in the second example of the manufacturing method of the package base material of the present invention, the (2) ...

Embodiment 1）

[0184] (1) Substrate preparation process

[0185] An epoxy resin substrate having a copper electrode disposed on its surface was prepared.

[0186] (2) Printing process

[0187] (2-1) Preparation of conductive paste

[0188] The raw materials were mixed in the ratio shown in Table 1, and stirred at 500 rpm for 30 minutes using a planetary mixer to prepare a conductive paste.

[0189] 【Table 1】

[0190]

[0191] In Table 1, the numerical values ​​of raw materials represent parts by weight.

[0192] In Table 1, regarding the silver-coated copper powder, the average particle diameter is 2 μm, the melting point of silver is 962° C., and the melting point of copper is 1085° C.

[0193] In Table 1, the average particle size of the silver powder is 5 μm, and the melting point is 962° C.

[0194]In Table 1, the average particle diameter of the Sn42%-Bi58% alloy is 10 μm, and the melting point is 139° C.

[0195] In Table 1, the average particle diameter of the Sn80%-Bi20% all...

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Abstract

Provided are a package substrate in which a metal pin enabling electrical connection is erected without inclining, and a method for manufacturing the package substrate. A package substrate according to the present invention is provided with: a base material; and an electrode arranged on the surface of the base material, and is characterized in that a metal pin is erected on the electrode via a cured product of a conductive paste including a metal powder and a thermosetting resin, and the metal powders include a low melting point metal and a high melting point metal having a melting point higher than that of the low melting point metal.

Description

technical field [0001] The present invention relates to a package base material and a method for manufacturing the package base material. Background technique [0002] In recent years, demands for increasing the capacity, speed, and power consumption of integrated circuits have increased rapidly, and demands for reducing the size and thickness of semiconductor packages have also increased rapidly. In order to realize miniaturization and thinning of semiconductor packages, Package on Package (PoP), which is obtained by laminating different package base materials such as logic package base materials and memory package base materials, has been proposed. 3D package. [0003] The basic PoP structure is: several package substrates with electrodes arranged on the surface are laminated with each other via solder balls. In PoP, each package substrate is electrically connected by solder balls. As a PoP including such a structure, there is the following laminated semiconductor packa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/12H01L21/60H05K3/34
CPCH01L23/12H01L23/49811H01L21/4867H01L25/105H01L2225/1058H01L2225/1023H05K3/321H05K3/4015H05K2201/10242H05K2201/10318H05K2201/10704H01L2224/11334H01L2224/1329H01L2224/133H01L2224/11515H01L2224/119H01L2224/11848H01L2924/381H01L2924/00012H01L2924/014H01L23/49H01L23/492H01L23/4828H01L23/49866H01L23/4924H05K3/34H01L21/52H01L25/0657
Inventor 山口范博
Owner TATSUTA ELECTRICWIRE & CABLE
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