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A kind of preparation method of inner mesh type cermet substrate material

A metal-ceramic base and plate material technology, which is applied in the field of ceramic preparation, can solve the problems of low expansion coefficient of ceramics and high thermal conductivity of metals, etc., and achieves the effect of enhancing heat dissipation and strength

Active Publication Date: 2021-12-14
山东鑫力能机械制造股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Traditional metal-ceramic composite materials are mostly prepared by powder metallurgy. Ceramics and metals are isolated from each other. The low expansion coefficient of ceramics and the high thermal conductivity of metals are not well utilized.

Method used

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  • A kind of preparation method of inner mesh type cermet substrate material
  • A kind of preparation method of inner mesh type cermet substrate material
  • A kind of preparation method of inner mesh type cermet substrate material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] A method for preparing an inner mesh type cermet substrate material, comprising the following steps:

[0045] S1. Weigh 60 parts of ceramic powder, 10 parts of water, 10 parts of binder, 2 parts of plasticizer and 1 part of dispersant according to the proportioning ratio to obtain ceramic slurry after uniform mixing;

[0046] S2. Dividing the ceramic slurry into two equal parts, taking one part and uniformly mixing with the networked microspheres accounting for 10% by mass;

[0047] S3. Inject the mixed ceramic slurry of the networked microspheres into the networked mold, and then apply a magnetic field to force the networked microspheres to be evenly distributed, and then inject the remaining ceramic slurry;

[0048] S4. After standing for 2 hours, after the ceramic slurry is semi-cured, it is heated to 60°C, triggering the decomposition of the microspheres into the network, thereby forming vertical through channels in the semi-cured ceramic slurry;

[0049] S5. After...

Embodiment 2

[0061] A method for preparing an inner mesh type cermet substrate material, comprising the following steps:

[0062] S1. Weigh 70 parts of ceramic powder, 15 parts of water, 15 parts of binder, 3 parts of plasticizer and 2 parts of dispersant according to the proportioning ratio to obtain ceramic slurry after uniform mixing;

[0063] S2. Divide the ceramic slurry into two equal parts, and take one part to uniformly mix with the networked microspheres accounting for 15% by mass;

[0064] S3. Inject the mixed ceramic slurry of the networked microspheres into the networked mold, and then apply a magnetic field to force the networked microspheres to be evenly distributed, and then inject the remaining ceramic slurry;

[0065] S4. After standing for 2.5 hours, the ceramic slurry is semi-cured and then heated to 70°C, triggering the decomposition of the microspheres into the network, thereby forming vertical through-holes in the semi-cured ceramic slurry;

[0066] S5. After heating...

Embodiment 3

[0070] A method for preparing an inner mesh type cermet substrate material, comprising the following steps:

[0071] S1. Weigh 80 parts of ceramic powder, 20 parts of water, 20 parts of binder, 5 parts of plasticizer and 3 parts of dispersant according to the proportioning ratio and mix uniformly to obtain ceramic slurry;

[0072] S2. Dividing the ceramic slurry into two equal parts, taking one part and uniformly mixing with the networked microspheres accounting for 20% by mass;

[0073] S3. Inject the mixed ceramic slurry of the networked microspheres into the networked mold, and then apply a magnetic field to force the networked microspheres to be evenly distributed, and then inject the remaining ceramic slurry;

[0074] S4. After standing for 3 hours, the ceramic slurry is semi-cured and heated to 80°C, triggering the decomposition of the microspheres into the network, thereby forming vertical through-holes in the semi-cured ceramic slurry;

[0075] S5. After heating for 5...

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Abstract

The invention discloses a method for preparing an inner net type cermet substrate material, which belongs to the technical field of ceramic preparation. The invention can trigger its decomposition action by heating in the semi-cured stage through the mixing of netted microspheres and ceramic raw materials, and then combine with the The residual moisture contacts to further trigger the generation of gas. On the one hand, the gas forms dense and uniform pores in the ceramic raw material. On the other hand, the tiny bubbles formed by the gas in the water expand and burst rapidly under heating. The central area of ​​the raw material is reamed to form a channel with a wide middle and narrow ends. When liquid phase infiltration is used, the metal or alloy can form a high-strength bond with the ceramic, and can quickly dissipate the heat directly. In addition, the microspheres are formed into a network In the process of ceramic molding, a dense two-dimensional network structure can be formed independently by magnetic force, and then a three-dimensional space heat dissipation structure is formed with metal, which greatly enhances the heat dissipation and strength of the cermet substrate material.

Description

technical field [0001] The invention relates to the technical field of ceramic preparation, and more specifically, to a method for preparing an inner mesh type cermet substrate material. Background technique [0002] Ceramic materials have stable chemical properties, good electrical insulation, and a linear expansion coefficient very similar to that of electronic components. They are one of the commonly used substrate materials in electronic components. However, the thermal conductivity of ceramic materials is relatively low, and it is difficult to meet the heat dissipation requirements of high-power integrated circuits or high-power LEDs. [0003] Because of the advantages of high thermal conductivity, mechanical strength and good processing performance, metal materials are still one of the main materials that people continue to develop and promote. However, the linear expansion coefficient of the metal material does not match that of the microelectronic chip, which will c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C1/10
CPCC22C1/1015C22C1/1036C22C1/1021
Inventor 刘思达
Owner 山东鑫力能机械制造股份有限公司
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