Combined type hollow liquid cooling box plate packaging structure

Abstract

The invention discloses a combined type hollow liquid cooling box plate packaging structure, and relates to a hollow liquid cooling box plate packaging structure. The center of the top surface of a central plate (4) is provided with a C-shaped groove; the two opposite sides of the outer portion of the C-shaped groove in the central plate (4) are provided with liquid cooling channels (5); the innerends of the two liquid cooling channels (5) are connected with the two ends of the C-shaped groove respectively; a U-shaped protruding strip A (2) of an upper plate (3) is arranged in a U-shaped protruding strip B (12) of a lower plate (11) to form a cavity (14) with an opening in one end; and the central plate (4) is arranged in the cavity (14). The liquid cooling channels which are difficultlyrealized by a traditional liquid cooling channel capping process are arranged on the separate central plate, and the central plate is subjected to combined packaging by using the upper plate and the lower plate through vacuum brazing or diffusion welding, so that the purpose of effectively packaging the complex liquid cooling channels is achieved.

Description

[0001] 【Technical field】 [0002] The invention relates to a packaging structure of a hollow liquid-cooled box plate, in particular to a package structure of a combined hollow liquid-cooled box plate. [0003] 【Background technique】 [0004] With the advancement of science and technology, the continuous development of various precision instruments, the miniaturization and compactness of precision instruments is the development trend, but the heat dissipation of miniaturized and compact precision instruments has always been a difficult problem in research, because usually radiators are generally They are all installed inside the precision instrument, and the radiator itself needs to occupy a large space, which increases the volume of the precision instrument virtually; the traditional solution is generally to set the outer box of the precision instrument as a hollow structure, The cooling liquid installed in the hollow outer box cools the internal precision instruments. When the...

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Problems solved by technology

[0004] With the advancement of science and technology, the continuous development of various precision instruments, the miniaturization and compactness of precision instruments is the development trend, but the heat dissipation of miniaturized and compact precision instruments has always been a difficult problem in research, because usually radiators are generally They are all installed inside the precision instrument, and the radiator itself needs to occupy a large space, which increases the volume of the precision instrument virtually; the traditional solution is generally to set the outer box of the precision instrument as a hollow structure, The cooling liquid installed in the hollow outer box cools the internal precision instruments. When the liquid cooling channel is more complicated, the traditional machining process will not be able to achieve the situation. At this time, it is necessary to cover the traditional liquid cooling channel. Improvements can be made to meet the requirements of various complex liquid cooling channels

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