Setup method of cutting apparatus
A cutting device and cutting fluid technology, which can be used in fine working devices, stone processing equipment, electrical components, etc., and can solve cutting problems
Active Publication Date: 2019-08-02
DISCO CORP
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- Abstract
- Description
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- Application Information
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Problems solved by technology
[0010] This reference position is a very important reference for determining the cutting accuracy of the cutting tool. If an inappropriate height position is registered as the reference position of the cutting unit, the workpiece may not be properly cut by the cutting tool.
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Embodiment Construction
[0026] An embodiment of one embodiment of the present invention will be described with reference to the drawings. First, use figure 1 , a cutting device for implementing the setting method of the present embodiment and a workpiece to be cut by the cutting device will be described. figure 1 It is a perspective view schematically showing a cutting device and a workpiece. The workpiece 1 is, for example, a substantially disk-shaped substrate or the like made of materials such as silicon, SiC (silicon carbide), or other semiconductors, or materials such as sapphire, glass, and quartz.
[0027] On the front surface of the workpiece 1 , devices such as ICs are formed in each region divided by a plurality of planned division lines arranged in a lattice shape. Finally, the workpiece 1 is divided along the planned dividing line to form individual device chips. For example, the workpiece 1 is held by the belt 5 stretched by the ring-shaped frame 3 , and is cut in the state of the fra...
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Provided is a setup method of a cutting apparatus to appropriately derive a reference position of a cutting unit. The setup method detects a position of the cutting unit as a reference position whena cutting blade contacts a chuck table by using the cutting apparatus including a setup unit for detecting the position of the cutting unit when an electrical conduction between the chuck table and the cutting blade is detected. The method includes a temporary reference position registration step of moving the cutting unit and registering a position when the electric conduction is detected as a temporary reference position; and a contact mark determination step of determining the presence / absence of a contact mark of the cutting blade. If it is determined in the contact mark determination stepthat there is the contact mark, a reference position setting step of setting the temporary reference position as the reference position is performed, and if it is determined in the contact mark determination step that there is no contact mark, the temporary reference position registration step and the contact mark determination step are performed again.
Description
technical field [0001] The present invention relates to a method of installing a cutting device that cuts a workpiece with a cutting tool. Background technique [0002] The device chip on which the semiconductor device is mounted is formed by dividing a semiconductor wafer, a package substrate, or the like. The front surface of a semiconductor wafer or the like is divided by a plurality of intersecting planned dividing lines, and semiconductor devices are formed in the divided regions. Then, when the semiconductor wafer or the like is divided along the planned dividing lines, individual device chips can be formed. . [0003] For dividing a semiconductor wafer or the like, for example, a cutting device having a cutting unit to which an annular cutting tool is attached is used. In the cutting device, the cutting tool is rotated in a plane perpendicular to the front surface of the workpiece such as a semiconductor wafer, the cutting tool is lowered to a predetermined height p...
Claims
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Patent Timeline
Login to View More IPC IPC(8): B28D5/02B28D5/00
CPCB28D5/022B28D5/0082B28D5/0058H01L21/78H01L21/67092H01L21/67259
Inventor 笠井刚史
Owner DISCO CORP