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Thermal environment analysis method and device, equipment and storage medium

An analysis method and analysis method technology, applied in the field of devices, equipment and storage media, and thermal environment analysis methods, can solve the problems of inaccurate thermal environment analysis, not in line with national conditions, etc., and achieve the effect of accurate results and simple operation.

Active Publication Date: 2019-08-02
洛阳众智软件科技股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, a thermal environment analysis method, device, equipment and storage medium are provided to solve the problems of inaccurate thermal environment analysis and inconformity with my country's national conditions in the prior art

Method used

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  • Thermal environment analysis method and device, equipment and storage medium
  • Thermal environment analysis method and device, equipment and storage medium

Examples

Experimental program
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Embodiment 1

[0037] figure 1 It is a flow chart of a thermal environment analysis method provided by an embodiment of the present invention. The method can be executed by the thermal environment analysis device provided by the embodiment of the present invention, and the device can be implemented in the form of software and / or hardware. refer to figure 1 , the method may specifically include the following steps:

[0038] S101. Apply the set grid analysis method to divide the target analysis area into at least two sub-areas, and sequentially number the sub-areas, wherein the set grid analysis method includes uniform grid analysis method and non-uniform grid analysis method grid analysis.

[0039] Specifically, the set grid analysis method includes a uniform grid analysis method and a non-uniform grid analysis method. Among them, the uniform grid analysis method refers to a calculation area according to the length and width of the minimum grid set in advance. Divide the area with the angl...

Embodiment 2

[0059] figure 2 It is a flow chart of another thermal environment analysis method provided by the embodiment of the present invention, and this embodiment is implemented on the basis of the above-mentioned embodiments. refer to figure 2 , the method may specifically include the following steps:

[0060] S201. Apply the set grid analysis method to divide the target analysis area into at least two sub-areas, and sequentially number the sub-areas, wherein the set grid analysis method includes uniform grid analysis method and non-uniform grid analysis method grid analysis.

[0061] S202. When the design index data includes the humidity and temperature of the black globe, apply the optimized thermal time constant model of the accumulation area and the improved regression model to determine the coefficients of the linear expression of the humidity and temperature of the black globe.

[0062] Specifically, when the design index data is Wet Bulb Globe Temperature (WBGT), the opti...

Embodiment 3

[0153] Figure 13 It is a schematic structural diagram of a thermal environment analysis device provided in an embodiment of the present invention, which is suitable for performing a thermal environment analysis method provided in an embodiment of the present invention. Such as Figure 12 As shown, the device may specifically include:

[0154] The area segmentation module 1301 is used to divide the target analysis area into at least two sub-areas by using a set grid analysis method, and sequentially number the sub-areas, wherein the set grid analysis method includes a uniform grid analysis method and non-uniform mesh analysis method;

[0155] The data classification module 1302 is used to apply the set thermal analysis algorithm to calculate the design index data of each sub-area, and classify the design index data according to the preset classification standard;

[0156] The display module 1303 is configured to add corresponding display marks to different types of design i...

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Abstract

The invention relates to a thermal environment analysis method and device, equipment and a storage medium, and the method comprises the steps: employing a set grid analysis method to divide a target analysis area into at least two sub-areas, carrying out the sequential numbering of the sub-areas, and the set grid analysis method comprising a uniform grid analysis method and a non-uniform grid analysis method; calculating design index data of each sub-region by applying a set thermal analysis algorithm, and classifying the design index data according to a preset classification standard; and adding corresponding display identifiers to different types of design index data, and displaying the display identifiers in the sub-regions of the corresponding numbers. And the thermal environment analysis accuracy is improved, so that the thermal environment analysis is more suitable for national conditions in China.

Description

technical field [0001] The invention relates to the technical field of architectural design, in particular to a thermal environment analysis method, device, equipment and storage medium. Background technique [0002] With the rapid development of the economy, urban modernization has also flourished, and many complex, diverse and large-scale modern buildings have emerged. With the continuous improvement of people's requirements for living and working environment, the indoor thermal environment and comfort of large-space buildings have gradually attracted people's attention. It is difficult to accurately analyze the indoor and outdoor thermal environment only by means of experiments and theoretical analysis. [0003] The calculation results of the current outdoor thermal environment analysis and design in some residential areas are usually inaccurate, or some analysis methods are not suitable for the actual situation in our country. Contents of the invention [0004] In vi...

Claims

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Application Information

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IPC IPC(8): G06F17/50
CPCG06F30/20G06F2119/08
Inventor 丁伟孟庆林李琼
Owner 洛阳众智软件科技股份有限公司
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