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Semiconductor device group and substrate

A technology of semiconductors and devices, which is applied in semiconductor devices, semiconductor/solid-state device testing/measurement, electric solid-state devices, etc., and can solve the problem of large space for semiconductor device groups

Inactive Publication Date: 2019-08-02
HUAIAN IMAGING DEVICE MFGR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the space occupied by the semiconductor device group itself is relatively large.

Method used

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  • Semiconductor device group and substrate
  • Semiconductor device group and substrate
  • Semiconductor device group and substrate

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Embodiment Construction

[0027] Hereinafter, various exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. It should be noted that unless specifically stated otherwise, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present disclosure.

[0028] The following description of at least one exemplary embodiment is actually only illustrative, and in no way serves as any limitation to the present disclosure and its application or use. That is to say, the structures and methods in this document are shown in an exemplary manner to illustrate different embodiments of the structures and methods in the present disclosure. However, those skilled in the art will understand that they only illustrate exemplary ways in which the present disclosure can be implemented, rather than exhaustive ways. In addition, the drawings are not necessarily drawn ...

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Abstract

The invention relates to a semiconductor device group and a substrate, and discloses a matched semiconductor device group for testing a semiconductor device. The semiconductor device group comprises aplurality of semiconductor devices including at least one semiconductor device extending in a first direction and at least one semiconductor device extending in a second direction different from thefirst direction, wherein each semiconductor device comprises a control electrode and first and second non-control electrodes; a first common electrode, wherein all the semiconductor devices share thefirst common electrode and use a part of the first common electrode as a control electrode thereof; and a second common electrode, wherein all the semiconductor devices share the second common electrode and use a part of the second common electrode as a first non-control electrode thereof.

Description

Technical field [0001] The present disclosure relates to the field of semiconductor technology, in particular, to a semiconductor device group and a substrate, and more specifically, to a matched semiconductor device group for testing semiconductor devices and a substrate including the device group. Background technique [0002] In the design of integrated circuit (IC) chips, there are semiconductor devices of different orientations, such as transistors. Different orientations and / or different impurity implantation angles will affect the characteristics of the device, causing the characteristics of devices with different orientations to deviate and not match. Therefore, a test device group needs to be set to test the matching of device characteristics. [0003] However, since the characteristics of each test device in the test device group need to be determined, it is necessary to provide test terminals (for example, pads (pads) for each device for testing. For example, for a tran...

Claims

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Application Information

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IPC IPC(8): H01L21/66H01L25/07
CPCH01L25/072H01L22/32
Inventor 王阳阳汤茂亮刘少东
Owner HUAIAN IMAGING DEVICE MFGR CORP