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MEMS and MEMS Microphone Packages

A technology of micro-electromechanical systems and microphones, which is applied in microelectronic microstructure devices, microstructure devices, and microstructure devices composed of deformable elements, etc., can solve the problems such as the quality reduction of MEMS microphones

Active Publication Date: 2020-11-24
KNOWLES ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In general, as traditional MEMS microphones get smaller, the quality of MEMS microphones decreases

Method used

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  • MEMS and MEMS Microphone Packages
  • MEMS and MEMS Microphone Packages
  • MEMS and MEMS Microphone Packages

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] Microelectromechanical systems (MEMS) acoustic microphones are used to convert acoustic signals (eg, changes in air pressure) into electrical signals. Figure 1A to Figure 1C is a cross-sectional view of a conventional MEMS acoustic microphone. exist Figure 1A to Figure 1C In each of the figures, MEMS microphone 100 includes base 105 , acoustic port 110 in base 105 , diaphragm 130 , back plate 135 , application specific integrated circuit (ASIC) 145 and cover 120 . Figure 1A is a cutaway view of the bottom port version of the MEMS microphone 100, Figure 1B is a cutaway view of the top port version of the MEMS microphone 100, Figure 1C is a cross-sectional view of a MEMS-on-lid version of MEMS microphone 100 . In alternative embodiments, any suitable pattern may be used.

[0027] refer to Figure 1A , the diaphragm 130 moves relative to the fixed back plate 135 as acoustic energy enters the acoustic port 110 . The capacitance between the diaphragm 130 and the bac...

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PUM

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Abstract

MEMS and MEMS microphone packages. A microelectromechanical system (MEMS) includes a diaphragm having a first face and a second face. The first side is exposed to environmental pressure. The second face includes a plurality of fingers extending from the second face. The MEMS also includes a backplate that includes a plurality of voids. Each finger of the plurality of fingers extends into a corresponding one of the plurality of voids. The MEMS also includes an insulator positioned between a portion of the diaphragm and a portion of the backplate. The diaphragm is configured to move relative to the backplate in response to changes in ambient pressure.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of and priority to U.S. Provisional Patent Application No. 62 / 439,803, filed December 28, 2016, which is hereby incorporated by reference in its entirety. technical field [0003] The present invention relates to MEMS and MEMS microphone packages. Background technique [0004] The following descriptions are provided to aid the reader's understanding. None of the information presented or references cited is admitted to be prior art. [0005] Microelectromechanical systems (MEMS) are used in electronic devices such as smartphones and tablet computers. MEMS microphones convert sound energy into electrical signals. Generally, as conventional MEMS microphones get smaller, the quality of the MEMS microphones decreases. However, space within devices using MEMS microphones is minimal, and the quality of MEMS microphones demanded by consumers and / or device manufacturers continues to incre...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/00
CPCH04R19/005H04R2410/00B81B7/0035B81B2203/053B81B2203/0136B81B2203/0127B81B3/0027B81B7/0032B81B2201/0257
Inventor M·纳瓦扎M·昆特兹曼M·佩德森
Owner KNOWLES ELECTRONICS INC