Unlock instant, AI-driven research and patent intelligence for your innovation.

Device and method for collecting good products of integrated circuit chip testing taping machine

A chip testing and integrated circuit technology, which is applied in the field of good product collection devices for integrated circuit chip testing and taping machines, can solve the problems of easily damaged pins of semiconductor devices, unable to meet production requirements, slow filling speed, etc., and achieves high work efficiency and satisfactory The effect of rapid production demand and labor saving

Active Publication Date: 2021-03-26
FUZHOU PALIDE ELECTRONICS TECH
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing qualified products of semiconductor devices are usually filled into the storage tube manually, which not only easily damages the pins of semiconductor devices during the filling process, but also has a slow filling speed, which cannot meet production needs
Collection equipment is also used for collection, but the structure is usually more complicated and the operation remains unchanged

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device and method for collecting good products of integrated circuit chip testing taping machine
  • Device and method for collecting good products of integrated circuit chip testing taping machine
  • Device and method for collecting good products of integrated circuit chip testing taping machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail with reference to the accompanying drawings, but the present invention is not limited thereto.

[0037] refer to Figure 1 to Figure 13

[0038] A good product collection device for integrated circuit chip testing tape braiding machine, including a frame 10, the upper part of the frame is longitudinally provided with a transmission channel 20 for receiving semiconductor devices, and the transmission channel is provided with a device for driving the semiconductor devices to the output side. The moving drive mechanism, the output end of the transmission channel has an arc-shaped storage part 21 that turns to the installation station, the output port of the arc-shaped storage part is equipped with a stopper mechanism 30, and the output port of the transmission channel is located on the frame. An installation ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a good product collecting device and method of an integrated circuit chip testing braider. The device comprises a frame; a conveying channel for receiving semiconductor devices is longitudinally formed in the upper part of the frame; the conveying channel is provided with a driving mechanism for driving the semiconductor devices to move to an output end side; an arc storage part turned to a mounting station is arranged at the output end of the conveying channel; a stop mechanism is arranged in an output port of the arc storage part; a mounting station for bearing storage pipes of the semiconductor devices is aslant arranged on the frame and positioned on the output end side of the conveying channel; a clamping mechanism for clamping the storage pipes is arranged atthe upper part of the mounting station; a pushing mechanism for pushing the storage pipes to move up is arranged at the lower part of the mounting station; and a storage pipe loading mechanism is arranged on the frame beside the mounting station.

Description

technical field [0001] The invention relates to a device and method for collecting good products of an integrated circuit chip testing tape machine. Background technique [0002] Semiconductor devices need to be loaded into the square strip-shaped storage tubes after they are manufactured and inspected to be qualified. The existing qualified products of semiconductor devices are usually filled into the storage tube manually, which not only easily damages the pins of semiconductor devices during the filling process, but also has a slow filling speed, which cannot meet the production needs. Collection equipment is also used for collection, but the structure is usually more complicated and the operation remains unchanged. For this reason, a method and device for collecting good products of integrated circuit chip testing and braiding machines are needed. Contents of the invention [0003] The object of the present invention is to provide a good product collection device and...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B07C5/38
CPCB07C5/38
Inventor 谢名富吴成君林康生
Owner FUZHOU PALIDE ELECTRONICS TECH