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Laser processing device and method for thin film material removal

A technology for laser processing and thin-film materials, applied in the field of lasers, can solve the problems of complex flat-top spot shaping technology and difficult application of thin-film materials, and achieve the effect of smooth edges, improved product yield and quality, and flat bottoms

Active Publication Date: 2021-11-02
WUHAN HGLASER ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to address the problems existing in the prior art, provide a laser processing device and method for thin film material removal, and solve the problems of complex flat top spot shaping technology and difficult application of thin film materials

Method used

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  • Laser processing device and method for thin film material removal
  • Laser processing device and method for thin film material removal
  • Laser processing device and method for thin film material removal

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Embodiment 1

[0052] In one embodiment of the device and method disclosed herein, a picosecond laser with a power of 50W and a wavelength of 1064nm is used to process a 0.3mm thick cop plastic surface paint layer at a processing speed of 300mm / s. After processing, the cop plastic The surface paint layer is removed cleanly, there is no taper, no heat effect, and the roughness of the processed bottom is 0.2um.

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Abstract

The invention discloses a laser processing device for removing thin film materials. Along the propagation path of laser light, a laser, a small hole diaphragm and a lens system are arranged in sequence. The lens system includes an equivalent lens one and a lens two. The laser emits After the Gaussian beam passes through the pinhole diaphragm and the lens system, a sharp-edged image is formed. At the same time, after the Gaussian beam passes through the pinhole diaphragm, diffraction orders with inconspicuous edges appear due to diffraction phenomena. Different diffraction orders pass through the aperture. After the above-mentioned lens system converges and superimposes, the spot of the Gaussian beam is imaged into light with sharp edges and a flat-top shape. The invention also discloses a laser processing method for removing thin film materials. The device and method disclosed by the invention solve the problems of complex flat top light spot shaping technology and difficult application of thin film materials.

Description

technical field [0001] The invention relates to the field of laser technology, in particular to a laser processing device and method for removing thin film materials. Background technique [0002] With the development of laser technology and the deepening of laser research, the application fields and application methods of laser processing have also expanded, and the requirements are also extremely high. The general laser output is the fundamental mode, and the cross-sectional light intensity in the beam propagation direction is Gaussian distribution, such as figure 1 As shown, it shows a distribution that is strong in the middle and gradually weakens around the periphery. Therefore, when the laser with Gaussian irradiance distribution is used to selectively remove thin film materials on the surface of heat-sensitive substrates, due to the difference in light intensity between the middle region and the edge region, or the middle region reaches a suitable energy density in a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/06B23K26/064B23K26/36B23K26/402
CPCB23K26/0648B23K26/36B23K26/402B23K26/064
Inventor 王雪辉王建刚温彬王玉莹白娟娟
Owner WUHAN HGLASER ENG CO LTD
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