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Thermal printhead

A printer head and heat-sensitive technology, which is applied in printing and other directions, can solve the problems of misidentification of marks, position deviation, decrease in the accuracy of pasting heat-generating substrates and heat dissipation plates, etc., and achieve the effect of reducing costs and preventing misidentification

Inactive Publication Date: 2003-02-12
ROHM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in recent years, the demand for a thermal printer head composed of a conductive protective film covering a heating resistor has been increasing. With the formation of such a conductive protective film, there has been a problem of sticking between the heating substrate and the heat sink. The problem of decreased accuracy
[0005] That is, since the color of the conductive protective film is similar to the same black as that of a generally black heating resistor, it becomes difficult to identify the first part and the final point of the heating resistor with a camera. The result is a positional deviation due to misidentification
[0006] For this reason, individual identification marks are required for heating resistors. Although countermeasures have been considered based on this, the shape of the marks still causes misidentification, so the required adhesion accuracy cannot be achieved.

Method used

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Embodiment Construction

[0048] Embodiments of the present invention are described in detail below with reference to the drawings:

[0049] figure 1 is a plan view of the thermal printer head A of this embodiment, and FIG. 2 is an exploded perspective view of the thermal printer head A of the same.

[0050] Such as figure 1 As shown, the thermal printer head A is characterized in that the heating substrate 2 made of ceramics and the synthetic resin substrate are positioned by using the positioning mark M having a positioning reference line perpendicular to the longitudinal direction of the heating substrate 2. The printed circuit board 3 is mounted on the radiator plate 1 made of metal such as aluminum. The forming process of the positioning mark M is the same process as the forming process of the common electrode mold 6 or the individual electrode mold 7 .

[0051] As shown in Fig. 2, on the cooling plate 1, the planes 11 and 12 for placing the substrate are formed in the upper and lower sections ...

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PUM

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Abstract

The object of the invention is to enhance precision in bonding the heating board and the radiating plate of a thermal print head, in the thermal print head A composed by attaching the heating board 2 on the surface of which a heating resistor for printing 4 is formed on the upper surface of the radiating plate 1, an identification mark M that functions as a positioning reference when the heating board 2 is attached on the radiating plate 1 is provided on the heating board 2 at a fixed interval from the heating resistor 4 and in addition, the identification mark M has a vertical side M1 equivalent to a positioning reference line D perpendicular to a direction in which the heating resistor of the heating board 2 is arranged (the direction of the x-axis).

Description

technical field [0001] The present invention relates to a heat-sensitive printer head composed of a heat-generating substrate and a heat-dissipating plate. Specifically, it relates to a heat-sensitive printer head provided with a positioning identification mark for pasting the heat-generating substrate on the heat-dissipating plate. Background technique [0002] Conventionally, this type of thermal printer head is constructed by mounting a heat-generating substrate made of ceramics on a heat-dissipating plate made of metal. Moreover, on the surface of the heating substrate, while forming the heating resistor for printing, its common electrode mold and individual electrode mold, several IC chips for driving are also mounted. When mounting the heat-generating substrate of the above-described configuration on a heat-dissipating plate, adhesives and adhesive tapes are generally used, but no matter which method is used, correct positioning is required. On the top, that is, to pe...

Claims

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Application Information

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IPC IPC(8): B41J2/335B41J2/345
CPCB41J2/33575B41J2/345B41J2/3357
Inventor 大山真吾
Owner ROHM CO LTD