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Anti-shedding device and wafer cleaning equipment

A technology for cleaning equipment and anti-shedding, applied in cleaning methods and appliances, cleaning methods using liquids, electrical components, etc., can solve problems such as easy detachment from the wafer carrier, achieve light weight, small wafer size, and reduce production cost effect

Active Publication Date: 2019-08-16
BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide an anti-dropping device and wafer cleaning equipment to solve the technical problem that the wafer is easily detached from the wafer carrier due to its small size and relatively light weight during the soaking process

Method used

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  • Anti-shedding device and wafer cleaning equipment
  • Anti-shedding device and wafer cleaning equipment
  • Anti-shedding device and wafer cleaning equipment

Examples

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Embodiment Construction

[0037] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0038] Such as figure 1 As shown, an anti-falling device provided by the present invention is used in conjunction with a device that needs to support and fix the object to be treated at the bottom through a carrying mechanism, and the object to be processed needs to be submerged in the liquid. The anti-falling device includes a drive Mechanism 200 and limit mechanism;

[0039] The limiting mechanism is used to be installed above the bearing mechanism, and the driving mechanism 200 is used to drive the limiting mechanism...

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Abstract

The invention provides an anti-shedding device and wafer cleaning equipment, and relates to the technical field of the cleaning equipment. The anti-shedding device comprises a driving mechanism and alimiting mechanism. The limiting mechanism is used for being installed on a bearing mechanism. The driving mechanism is used for driving the limit mechanism to move close to or away from the bearing mechanism so that the object to be treated can be restricted from disengaging from the bearing mechanism above the object to be treated when the limiting mechanism is close to the bearing mechanism, and the limiting mechanism is enabled to take and place the object to be treated when the limiting mechanism is away from the bearing mechanism. The anti-shedding device ensures that the wafer can be cleaned and soaked before cleaning so that the wafer is prevented from being small in size and low in weight, and the situation that the wafer is separated from the wafer carrier disk due to the buoyancy force of the wafer and the surface tension of the chemical liquid and even the wafer falls out of the carrier disk when the wafer is about to enter the chemical liquid and the wafer is damaged can be prevented.

Description

technical field [0001] The invention relates to the technical field of cleaning equipment, in particular to an anti-shedding device and wafer cleaning equipment. Background technique [0002] In the semiconductor wafer manufacturing process, in order to improve production efficiency and save labor costs, fully automatic cleaning equipment is usually used to clean the wafer. [0003] During the whole process of cleaning the wafer, due to the small size and easy damage of the wafer, custom-made carrier plates are usually used for loading, transportation and cleaning. [0004] In the prior art, before the wafer is cleaned, the wafer is usually cleaned and soaked with a tank-type device. Due to the small size and light weight of the wafer, when the wafer is about to enter the chemical solution, it will be damaged by the wafer itself. The buoyancy and the tension on the surface of the chemical liquid detach from the wafer carrier, and even the wafer falls out of the carrier, res...

Claims

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Application Information

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IPC IPC(8): H01L21/67B08B3/08B08B13/00
CPCB08B3/08B08B13/00H01L21/67057
Inventor 郭立刚祝福生王文丽秦亚奇周福江
Owner BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC