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SMT chip mounter and chip mounting production process thereof

A technology of placement machines and machines, applied in the direction of electrical components, printed circuit manufacturing, electrical components, etc., can solve problems affecting motherboard rework and production efficiency, fixed deviations, etc., to reduce bump damage, reduce deviations, and improve work efficiency Effect

Active Publication Date: 2019-08-16
铜陵金基科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the deficiencies in the prior art, the purpose of the present invention is to provide an SMT placement machine and its placement production process, which solves the problem of easy fixation and deviation when the suction nozzle is placed in the prior art, which affects the rework and production of the main board. benefit

Method used

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  • SMT chip mounter and chip mounting production process thereof
  • SMT chip mounter and chip mounting production process thereof
  • SMT chip mounter and chip mounting production process thereof

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Embodiment Construction

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0035] Such as figure 1 As shown, the present invention provides a kind of SMT pick and place machine, comprises machine body 1, holding frame 2, driving module 3, sucker seat 5, and machine body 1 is the box body structure that both ends pass through, and on the machine The bottom of the box where the main body 1 is located is provided with two parallel guide rails 11, and a suction cup group is arranged on the machine body 1 between the guide rails 11. Sliding h...

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Abstract

The invention discloses a SMT chip mounter and a chip mounting production process thereof. The SMT chip mounter comprises a machine body. The machine body has a box structure of which the two end parts are through. A guide rail is arranged at the bottom of the box body where the machine body is located. A holding frame slides on the guide rail. The holding frame comprises a holding table, extrusion blocks are fixed on the opposite surfaces of the edge through telescopic columns. Guide grooves are symmetrically arranged at the bottom of the holding table. The guide grooves slide along the direction of the guide rail. A suction nozzle is connected on the top of the box body where the machine body is located through a driving module. The driving module comprises a conveyor belt arranged on the top of the box body of the machine body and a first hydraulic column arranged at the front end of the conveyor belt, and the suction nozzle is connected on the bottom of the first hydraulic column through a fixing plate. The whole operation is convenient, the absorption and transfer effect of the workpiece can be improved by the suction nozzle and collision of the suction nozzle to the mainboardcan be reduced; besides, the suction disc group is arranged so that effective fixing of the mainboard during processing can be realized and improve the precision of chip mounting can be enhanced.

Description

technical field [0001] The invention belongs to the technical field of SMT placement equipment, and in particular relates to an SMT placement machine and a production process for the placement thereof. Background technique [0002] With the continuous development of science and technology, SMT patch is the main component of SMT production, and it is widely used in the production of electronic original devices. In the production line, the SMT patch machine is configured after the dispenser or screen printing machine. It is a device that accurately places surface mount components on PCB pads by moving the placement head. [0003] The most critical component in the SMT placement machine is the nozzle. The nozzle of the placement machine is not only the key component of the placement machine and the placement of the absorbed originals, but also the background when the camera of the optical vision system takes pictures. It is mainly It uses vacuum adsorption to adsorb components...

Claims

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Application Information

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IPC IPC(8): H05K3/34H05K13/04H05K13/00
CPCH05K3/341H05K13/0061H05K13/046H05K13/0409
Inventor 石爱民谢晨智卞石杰
Owner 铜陵金基科技有限公司
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