Abstract
The invention discloses a magnetron sputtering coating device. The magnetron sputtering coating device comprises a vacuum chamber, a substrate table is arranged at the lower end of the interior of thevacuum chamber, a target seat is arranged at the upper end of the substrate table, a fixing device is arranged at the upper end of the target seat, a rotating device is arranged at the upper end of the interior of the vacuum chamber, a connecting piece is arranged at the lower end of the rotating device, a magnetic control target is arranged at one end of the connecting piece, the rotating devicecomprises a fixing frame, the upper end of the fixing frame is connected with the upper end of the interior of the vacuum chamber, two sets of fixing rods are arranged between the upper ends of the fixing frame, sliding plates are arranged on the fixing rods in a sleeved mode, two groups of movable rods are arranged on the two sides of the top of the sliding plates in a penetrating mode, one endsof the two groups of movable rods are fixedly connected with one side of the connecting piece, a movable block is arranged at one end, far away from the connecting piece, of the two groups of movablerods, a sliding block is arranged at the lower end of the movable block, the sliding block is located on the inner side of a sliding chute, the sliding block is matched with the sliding chute, the sliding chute is positioned at the upper end of a movable disc, on one side of the lower end of the movable disc and is connected with the fixed frame; a screw rod matched with the slide block is arranged in the slide block in a penetrating manner.
Description
technical field
[0001] The invention relates to the technical field of magnetron sputtering, in particular to a magnetron sputtering coating equipment. Background technique
[0002] At present, magnetron sputtering technology is a surface modification technology that has been widely used in experiments and production in the fields of physical science and material science. Magnetron sputtering coating is a technology that uses energetic particles to bombard the target surface in vacuum, so that the bombarded particles are deposited on the substrate. It is to add a magnetic field in the sputtering environment, and use the Lorentz force of the magnetic field to bind the surface of the cathode target. The movement of electrons leads to the increase of high-energy ions bombarding the target and the decrease of high-energy electrons bombarding the substrate, which makes the coating process have the characteristics of low temperature and high speed. Among the magnetron sputtering c...
