Heat sinks and electronics

Abstract

The present application provides a heat dissipation device and electronic equipment, the first radiator and the second radiator included in the heat dissipation device are fastened on the printed circuit board PCB through a connecting device; the connecting device includes a fixing tube, a fixing column and a first elastic Component; the first heat sink is fixed to the fixed tube; the fixed tube is sleeved with a fixed column, the upper surface of the fixed tube is against the lower surface of the first protrusion of the fixed column, and the lower surface of the fixed tube is against the PCB on the upper surface; the fixing column passes through the second radiator and the first radiator from top to bottom; a first elastic element is arranged between the second radiator and the second protrusion of the fixing column, and the first elastic element is nested On the outside of the fixed column and in a compressed state, the second protrusion is located above the first protrusion. The technical solutions of the embodiments of the present application can combine the independent connection devices for fixing the first heat sink and the second heat sink into one, which can reduce the occupied PCB area and increase the area of ​​the heat sink.

Description

technical field [0001] The present application relates to the field of electronic equipment, and more specifically, to a heat dissipation device and electronic equipment. Background technique [0002] A printed circuit board (PCB) is widely used in the field of electronic products. One or more main chips are usually arranged on the PCB, and multiple peripheral devices are arranged around each main chip in the PCB. Due to the close layout between multiple main chips and between the main chip and peripheral devices, as the power density continues to rise, the heat dissipation requirements are getting higher and higher. heat dissipation of the device. [0003] Considering that the main chip has high requirements for heat dissipation, the main chip dissipates heat independently, while all peripheral devices use a common heat sink for heat dissipation. To fix the two heat sinks, it is necessary to fasten the common heat sink to the PCB through the connection device, and then p...

AI Technical Summary

Problems solved by technology

[0004] In this way, fixing the heat sink requires more connecting devices, which will occupy more area of ​​PCB and heat sink. With the continuous upgrading of products, the impact of this problem on PCB layout becomes more and more prominent.

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