Modified phenolic molding compound with high bending strength and preparation method of modified phenolic molding compound

A phenolic molding compound and flexural strength technology, applied in the field of phenolic plastics, can solve the problems of easy deformation of phenolic molding compound, reducing brittleness of phenolic molding compound, decrease in tensile strength and compressive deformation resistance of phenolic molding compound, etc. The effect of internal small molecule residues, improved fluidity, and improved processability

Inactive Publication Date: 2019-08-23
浙江安瑞电器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the disadvantage is that while reducing the brittleness of the phenolic molding compound, the tensile strength and compression deformation resistance of the phenolic molding compound decrease, resulting in the easy deformation of the phenolic molding compound

Method used

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  • Modified phenolic molding compound with high bending strength and preparation method of modified phenolic molding compound
  • Modified phenolic molding compound with high bending strength and preparation method of modified phenolic molding compound
  • Modified phenolic molding compound with high bending strength and preparation method of modified phenolic molding compound

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] A modified phenolic molding compound with high bending strength, the modified phenolic molding compound includes the following raw materials in parts by mass:

[0048] 200 parts of thermosetting phenolic resin,

[0049] 4-6 parts of 2-formyl-3,4-dihydropyran,

[0050] 3-5 parts of polyvinyl alcohol,

[0051] Release aid 0.2-4 parts,

[0052] Filling 7-12 parts,

[0053] Pigment 2-3.5 parts,

[0054] Wherein the thermosetting phenolic resin is a liquid thermosetting phenolic resin.

[0055] The thermosetting phenolic resin can be commercially available or self-prepared, as follows:

[0056] Phenol and basic catalyst (NaOH or KOH) are added to the reactor at a mass ratio of 1:0.05, and then formaldehyde is added to the reactor at a molar ratio of phenol:formaldehyde=1:1.5 for reaction. The reaction temperature is 95-110°C and the reaction time is 1h , and then remove moisture and unreacted raw materials under normal pressure and then under reduced pressure to obtain...

Embodiment 2

[0088] A modified phenolic molding compound with high bending strength, based on the basis of Example 1B, the difference is that the release agent is commercially available stearic acid, calcium stearate, zinc stearate, magnesium stearate One of them, the part by mass of the release aid is 0.2-0.4 parts.

[0089] Example 2A Example 2B Example 2C Example 2D Release aid stearic acid Calcium stearate Zinc stearate Magnesium stearate

[0090] The test results of the sample obtained in Example 2 are as follows.

[0091] Testing Standard Example 2A Example 2B Example 2C Example 2D Specific gravity / g·cm -3

- 1.79 1.79 1.79 1.79 Tensile strength / MPa TS-INT-002 122 124 130 125 Bending strength / MPa GB T 9341-2008 192 197 198 196 Flexural modulus / GPa GB T 9341-2008 16.53 16.61 16.65 16.63 Impact strength / KJ m -2

ASTM D256-2010E1 16.6 16.8 17 16.9 TVOC / μg·g -1

TS-I...

Embodiment 3

[0095] A modified phenolic molding compound with high bending strength, based on the basis of Example 1B, the difference is that the filler is commercially available shell powder that has not been calcined or heated at high temperature.

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Abstract

The invention relates to a phenolic plastic, discloses a modified phenolic molding compound with high bending strength and a preparation method of the modified phenolic molding compound, and solves the problems that properties such as tensile strength and flexural modulus of a phenolic molding compound are reduced when brittleness of the phenolic molding compound is reduced in the prior art. The modified phenolic molding compound with the high bending strength comprises the following raw materials, in parts by mass: 200 parts of thermosetting phenolic resin, 4-6 parts of 2-formyl-3,4-dihydropyran, 3-5 parts of polyvinyl alcohol, 0.2-4 parts of a demolding auxiliary agent, 7-12 parts of a filler, and 2-3.5 parts of a pigment, wherein the thermosetting phenolic resin is liquid thermosettingphenolic resin; and the method comprises the steps of firstly mixing the 2-formyl-3,4-dihydropyran and the thermosetting phenolic resin for a reaction, then adding the polyvinyl alcohol, performing areaction under mixing, adding the demolding auxiliary agent, the filler and the pigment, performing mixing, and performing plastication to obtain the modified phenolic molding compound. According to the method provided by the invention, the rigidity and toughness performance are improved while the brittleness of the modified phenolic molding compound is reduced.

Description

technical field [0001] The invention relates to phenolic plastics, in particular to a modified phenolic molding compound with high bending strength and a preparation method thereof. Background technique [0002] Bakelite is a thermosetting plastic based on phenolic resin, widely used as electrical insulation materials, furniture parts, daily necessities, handicrafts, etc. Phenolic molding compound is a kind of phenolic plastic, which is made of raw materials such as phenolic resin, filler and other additives. Phenolic molding compounds are the same as phenolic plastics, which have high rigidity, high heat resistance, water resistance, oil resistance and mold resistance, but at the same time, they have the problems of high brittleness and easy bending and fracture. [0003] In this prior art, the formulation of phenolic molding compound is improved. For example, the Chinese patent "a high bending strength phenolic molding compound" with the authorized announcement number CN...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/06C08L29/04C08K7/24C08K5/1545C08K5/098C08K9/04C08K3/013C08K5/00C08K5/41
CPCC08L61/06C08L29/04C08K7/24C08K5/1545C08K5/098C08K9/04C08K3/013C08K5/0041C08K5/41
Inventor 高干江
Owner 浙江安瑞电器有限公司
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