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Semiconductor device, display panel, display device, and manufacturing method

A manufacturing method and semiconductor technology, which are applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve the problem that the circuit structure is difficult to meet the design margin and other problems

Active Publication Date: 2019-08-23
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] As the resolution increases toward FHD (Full High Definition, full HD), QHD (Quarter High Definition, 1 / 4 of the full HD screen resolution) and even higher resolutions, the wiring density continues to increase, and the circuit structure in related technologies has been It is difficult to meet the design margin (margin)

Method used

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  • Semiconductor device, display panel, display device, and manufacturing method
  • Semiconductor device, display panel, display device, and manufacturing method
  • Semiconductor device, display panel, display device, and manufacturing method

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Embodiment Construction

[0037] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. The description of the exemplary embodiments is illustrative only, and in no way restricts the disclosure, its application or uses. The present disclosure can be implemented in many different forms and is not limited to the embodiments described here. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. It should be noted that relative arrangements of parts and steps, compositions of materials, numerical expressions and numerical values ​​set forth in these embodiments should be interpreted as illustrative only and not as limiting, unless specifically stated otherwise.

[0038] "First", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distin...

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PUM

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Abstract

The invention provides a semiconductor device, a display panel, a display device and a manufacturing method, and relates to the technical field of display. The semiconductor device includes a substrate, a light shielding layer on the substrate, an insulating layer covering the light shielding layer, and a wire at a side of the insulating layer facing away from the light shielding layer. The material of the light shielding layer comprises a conductive material, and the wire is connected with the shading layer in parallel. Therefore, the resistance of the wire is reduced equivalently. When a current flows through the wire, the heat generated by the wire can be reduced.

Description

technical field [0001] The present disclosure relates to the field of display technology, and in particular to a semiconductor device, a display panel, a display device and a manufacturing method. Background technique [0002] Organic Electroluminescent Display (OLED) has gradually become the mainstream in the display field due to its low power consumption, high color saturation, wide viewing angle, thin thickness, and flexibility. It can be widely used in terminal products such as smartphones, tablet computers, and TVs. Among them, flexible OLED products are the most prominent. The flexible OLED product has gradually become the mainstream of OLED display because it can meet various special structures. [0003] As the resolution increases toward FHD (Full High Definition, full HD), QHD (Quarter High Definition, 1 / 4 of the full HD screen resolution) and even higher resolutions, the wiring density continues to increase, and the circuit structure in related technologies has b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32H01L51/52H01L51/56
CPCH10K59/38H10K59/179H10K59/126H10K50/86H10K71/00H10K59/131H10K59/1201H01L27/124H01L27/1262
Inventor 田宏伟牛亚男王纯阳李栋刘政张帅
Owner BOE TECH GRP CO LTD