Display panel and manufacturing method thereof
A technology for the preparation of display panels and substrates, used in semiconductor devices, electrical components, circuits, etc., can solve problems such as breakage of signal lines, separation of double-layer alignment films, etc., to improve the screen ratio, avoid separation from each other, and improve stability. Effect
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Embodiment 1
[0039] Such as image 3 , Figure 4 As shown, this embodiment provides a display panel, including: a hard substrate 1 , a first area 2 , a second area 3 , a third area 4 and a driving circuit unit 5 .
[0040] The thickness of the hard substrate 1 is 2000-3000 μm. The hard substrate 1 is a glass substrate. The hard substrate 1 is in contact with the first area 2 and the second area 3 and is located between the first area 2 and the second area 3 .
[0041] The first area 2 is disposed on the top surface of the hard substrate 1 , and the first area 2 includes: a protection layer 21 , a first substrate 22 , a buffer layer 23 , a second substrate 24 and a first data line 25 .
[0042] The protective layer 21 is arranged on the top surface of the hard substrate 1, and the protective layer 21 is a back plate (Back Plate, referred to as BP), and the BP is specifically composed of a release film (Release Film), an adhesive (Adhesive), PET and a substrate layer ( Primary liner), the ...
Embodiment 2
[0070] Such as Figure 8 As shown, most of the technical solutions of this embodiment are the same as those of Embodiment 1, the difference is that, in the manufacturing method of the display panel provided by this embodiment, no cutting process is required, and the specific steps include S100-S400.
[0071] S100 The hard substrate setting step, providing a hard substrate, a first area, a second area and a third area. The hard substrate setting step includes steps S110-S140 (see Figure 9 ).
[0072] S110 a first substrate preparation step, providing a protective layer, and preparing a first substrate on the upper surface of the protective layer. The protective layer is a back plate (Back Plate, BP for short), and BP is specifically composed of a release film (Release Film), an adhesive (Adhesive), PET and a substrate layer (Primary liner). The release film and primary liner are BP The upper and lower protective films will be torn off during the manufacturing process. The ...
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Abstract
Description
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