Production of sintered conductive thin-sheet and thin-plate and ceramic substrate and processing method thereof
A manufacturing method and technology of conductive sheet, which can be used in semiconductor/solid-state device manufacturing, manufacturing tools, stone processing tools, etc., and can solve problems such as time-consuming, obstacles, and low production efficiency.
Inactive Publication Date: 2003-02-19
SUMITOMO SPECIAL METAL CO LTD
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Problems solved by technology
Therefore, when a thinner ceramic substrate is required in the future, it is conceivable that the production efficiency will be significantly reduced by forming the substrate with the current method, and the processing steps such as grinding after sintering will take a lot of time.
This is undoubtedly a great obstacle to the expansion and reproduction of thin film magnetic heads.
[0005] In addition, the problem of "convexity" is not limited to ceramic substrates for thin-film magnetic heads, but also occurs widely when forming thin-plate-shaped sintered bodies.
For this reason, it takes a lot of time to eliminate the unevenness, and there is a problem that the production cost is increased. The above-mentioned problems also exist in a large number in the production method of the sintered body including the firing process (for example, "the production method of the sintered magnet".
Method used
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Embodiment Construction
[0030] Embodiment of the invention
[0031] The present invention solves the problem of "convexity" caused by various reasons when forming a sintered body with a thickness of 2mm or less by using the process of sintering phenomenon such as hot pressing, and forming a thickness without the problem of "convexity" (such as After the thicker sintered body with a thickness exceeding 2 mm), the sintered body was sliced into two thin slices.
[0032] Embodiments of the present invention will be described below with reference to the drawings.
[0033] First, in reference to figure 1 Referring to Fig. 3, a method for manufacturing a ceramic substrate for a thin film magnetic head according to the present invention will be described.
[0034] figure 1 It is a flowchart showing the main procedures of the manufacturing process of the ceramic substrate. With this embodiment, after preparing raw material powders such as alumina and titanium carbide in step S1, the step S2 of mixing th...
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Abstract
A conductive sintered body 10 having little camber and substantially parallel two faces is formed by calcination of raw material, and thereafter the conductive sintered body 10 is sliced along a face nearly parallel to the two faces of the conductive sintered body 10 by wire electrical discharge machining, and two or more ceramics sintered bodies 10a, 10b for a thin film magnetic head are separated by cutting from the conductive sintered body 10. The surfaces of the ceramics sintered bodies 10a 10b are polished only during a comparatively short period, thereby obtains a board thickness of 1.2 mm or less.
Description
technical field [0001] The present invention relates to a method for manufacturing a conductive sheet, a thin-plate sintered body, and a ceramic substrate for a thin-film magnetic head, and a method for processing the conductive sheet. Background technique [0002] In recent years, various magnetic recording devices such as hard disk drive (HDD) devices such as computers and floppy disk drive (FDD) devices use thin-film magnetic heads. Along with the miniaturization of thin-film magnetic heads, the thickness of the conductive sheet used as the substrate for the magnetic head is becoming thinner. In order to seek high hardness and wear resistance of substrates for magnetic heads, Al 2 o 3 -Ti system, SiC system and ZrO 2 Ceramic materials with equal components. For example, as a ceramic substrate for a magnetic head, the widely used ALTIC sheet is made by sintering and processing alumina (Al 2 o 3 ) and titanium carbide (TiC) and other raw materials. Although ALTIC she...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L21/304B23H7/02B23H9/00B28D1/22
CPCB23H7/02B23H9/00H01L21/304
Inventor 福田诚竹马正则
Owner SUMITOMO SPECIAL METAL CO LTD