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Clamping device and carrying system for square parts

A technology of clamping device and handling system, which is applied in the direction of conveyor objects, transportation and packaging, etc., can solve problems such as difficulties encountered in manufacturing, and achieve the effects of tight closing, stable clamping action, and improved precision

Active Publication Date: 2019-09-06
SHANGHAI TUNA ELECTRIC MECHANIC EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Even if particulate contamination during the manufacturing process does not affect the functionality of the semiconductor component circuits, it can still cause difficulties in manufacturing

Method used

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  • Clamping device and carrying system for square parts
  • Clamping device and carrying system for square parts
  • Clamping device and carrying system for square parts

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Embodiment Construction

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0037] In describing the present invention, it should be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the descriptio...

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PUM

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Abstract

The invention discloses a clamping device and a carrying system for square parts, and the clamping device is used for clamping the square parts in a vertical state in a wafer cleaning production line.The clamping device comprises a framework, a first gas cylinder, a second gas cylinder, a left arm and a right arm, wherein a first slide rail and a second slide rail, which are in the horizontal state, are fixed in the framework; a main body of the first gas cylinder is arranged on the first slide rail in a sliding mode; the piston of the first gas cylinder is fixedly connected on the framework;the piston of the first gas cylinder is positioned at the left side of the main body of the first gas cylinder; the main body of the second gas cylinder is arranged on the second slide rail in the sliding mode; the piston of the second gas cylinder is fixedly connected on the framework; and the piston of the second gas cylinder is positioned at the right side of the main body of the second gas cylinder. Two kinds of reverse force are utilized to generate parallel reverse motion of a first horizontal arm and a second horizontal arm, and a vertical clamp is driven to precisely and stably clampthe square parts.

Description

technical field [0001] The invention belongs to the field of wafer manufacturing, and in particular relates to a clamping device and a handling system for a square piece. Background technique [0002] The manufacture of semiconductor components with microstructures requires high-precision technology. During the manufacturing process, the tiny particles existing on the circuit of the semiconductor device will reduce the reliability of the finished semiconductor device. Even if particulate contamination during the manufacturing process does not affect the functionality of the semiconductor device circuitry, it still causes difficulties in manufacturing. Therefore, the semiconductor device needs to be manufactured in a dust-free environment, and the surface of the semiconductor device needs to be cleaned to remove fine particles generated during the manufacturing process. [0003] Wafer cleaning usually requires multiple cleaning processes such as spraying, ultrasonic, chemic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G47/90
CPCB65G47/902
Inventor 李杰葛林海丁高生陈景韶葛林新
Owner SHANGHAI TUNA ELECTRIC MECHANIC EQUIP CO LTD