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Method and control device for the throughput-optimised production of printed circuit boards on a pick-and-place line

A control device, assembly line technology, applied in the field of manufacturing or assembly lines, computer program products, to achieve the effect of increasing production

Active Publication Date: 2019-09-06
SIEMENS AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The retrofit process for equipment changeover from one equipment family to another also has the consequence of downtime typically 30 minutes

Method used

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  • Method and control device for the throughput-optimised production of printed circuit boards on a pick-and-place line
  • Method and control device for the throughput-optimised production of printed circuit boards on a pick-and-place line
  • Method and control device for the throughput-optimised production of printed circuit boards on a pick-and-place line

Examples

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Embodiment Construction

[0065] figure 1 An exemplary assembly system 100 is shown. The assembly system 100 includes one or more assembly lines 110 and a processing or control device 115 . Each assembly line 110 includes an optional transport system 125 and one or more automated assembly machines 130 . Each automatic assembly machine 130 includes one or more assembly heads 135, which are respectively set up to receive a device 155 from an assembly table 140 and position it on a circuit board at a predetermined position, which is in the on the transport system 125. During the assembly process, circuit board 120 is generally at rest with respect to automatic assembly machine 130 .

[0066] These equipment stations 140 respectively include a plurality of conveying devices 150, wherein figure 1 Only one is exemplarily shown in . Each delivery device 150 is prepared with a stock of devices 155 of a predetermined device type 160 . For these devices 155 , the conveying device 150 usually has a containe...

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PUM

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Abstract

The invention relates to a method and a control device for the throughput-optimised production of printed circuit boards on a pick-and-place line. The invention relates to a method for the throughput-optimised production of printed circuit boards (120) on a pick-and-place line (110), wherein: the printed circuit boards are divided into groups known as clusters; each cluster (175) is produced usingone set-up; the set-up is realised by means of changing tables (140) that can be attached to the pick-and-place line, each changing table having at least one feed device (150) for keeping ready stocks of components (155); a quantity of changing tables needed for each set-up is referred to as a changing table set and an empty changing table set comprises changing tables having feed devices that are empty. In the exemplary embodiment, five clusters having variant set-ups (VI to V5) and one cluster having a fixed set-up F are completed on a pick-and-place line. Two changing table sets are provided for completing the clusters with variant set-ups. There is therefore no waiting time for the clusters having fixed set-ups because the fixed set-ups are only set up once and then retained in this respect for an extended (planning) period. In one embodiment of the invention, clusters having fixed set-ups can be inserted into the production sequence at 'intermediate positions' or fitted in therebetween. This has the advantage that waiting times during production for completion of the necessary variant set-ups can be avoided in this way.

Description

technical field [0001] The invention relates to a method for producing circuit boards on an assembly line with optimized yield. Furthermore, the invention relates to a control device for an assembly system or a production or assembly line for assembling circuit boards (structural assemblies) from components or components. Furthermore, the invention relates to a computer program product. Background technique [0002] Especially in the field of electronic device production, the circuit boards or structural assemblies to be produced are produced by surface mounted technology (SMT) on SMT assembly lines. A manufacturer of SMT automatic assembly machines (pick and place) and SMT assembly systems with the product name SIPLACE is, for example, the manufacturer ASM (http: / / www.siplace.com / en / Home). [0003] An assembly line is formed of a plurality of automatic assembly machines which are usually connected by a transport system and which cooperate, for example, for the manufacture...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/08
CPCH05K13/085G05B19/41865G05B2219/45026
Inventor A.普法芬格C.罗耶
Owner SIEMENS AG