Heat dissipation mechanism of component heat transfer system

Abstract

The invention discloses a heat dissipation mechanism of a component heat transfer system. The heat dissipation mechanism comprises components, wherein a heat conduction plate is arranged at the bottoms of the components; heat conduction fins are fixedly connected to the bottom of the heat conduction plate, and a PCB is arranged at the bottom of the heat conduction fins; a miniature cooling fan isarranged on the upper surface of the right side of the PCB; an air collection cover is fixedly connected to the top of the miniature cooling fan; a heat dissipation pipe is communicated with the leftside of the air collection cover; and one end, away from the air collection cover, of the heat dissipation pipe is communicated with the right side of the heat conduction plate. According to the heatdissipation mechanism, the miniature cooling fan is started to convey the cold air to the interior of the heat conduction plate through the heat dissipation pipe, so that the heat conduction plate canbe rapidly cooled, and the problems that the heat dissipation effect of the existing heat transfer system is poor, a common radiator is used for dissipating heat of the bottom of the heat conductionplate, heat dissipation is carried out gradually from outside to inside, and the heat dissipation efficiency is low can be solved; and the heat dissipation mechanism of the component heat transfer system has the advantages of being high in internal heat dissipation efficiency and prolonging the service life of components.

Description

technical field [0001] The invention relates to the technical field of electronic products, in particular to a heat dissipation mechanism of a component heat transfer system. Background technique [0002] Generally, electronic components (such as chips, integrated circuits, transistors, etc.) in electronic equipment will generate heat during operation. If this heat is not removed, it may cause the electronic components to operate at a temperature higher than their normal operating temperature. It will adversely affect the operation stability and service life of electronic components and electronic equipment. [0003] However, in the existing heat transfer system, the heat dissipation effect is poor. Generally, the heat dissipation of the heat sink intelligently dissipates heat from the bottom of the heat conduction plate, and gradually dissipates heat from the outside to the inside when dissipating heat. The heat dissipation efficiency is low and the heat dissipation speed i...

AI Technical Summary

Problems solved by technology

[0002] Generally, electronic components (such as chips, integrated circuits, transistors, etc.) in electronic equipment will generate heat during operation. If this heat is not removed, it may cause the electronic components to operate at a temperature higher than their normal operating temperature. operation, which will adversely affect the operation stability and service life of electronic components and electronic equipment

[0003] However, in the existing heat transfer system, the heat dissipation effect is poor. Generally, the heat dissipation of the heat sink intelligently dissipates heat from the bottom of the heat conduction plate, and gradually dissipates heat from the outside to the inside when dissipating heat. The heat dissipation efficiency is low and the heat dissipation speed is slow.

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