Electronic device and method of manufacturing the same

Abstract

An electronic device includes a display panel, a cover plate, a touch layer and a fingerprint identification sensor. The display panel has opposite first and second surfaces. The cover plate is disposed on the first surface of the display panel. The touch layer is disposed between the display panel and the cover plate. The fingerprint identification sensor includes a sensor electrode layer, a first conductive layer, a piezoelectric material layer and a second conductive layer. The sensor electrode layer is pasted on the second surface of the display panel with an adhesive layer. The first conductive layer is disposed on the sensor electrode layer. The first conductive layer has a connected first portion and a second portion. The first portion contacts the sensor electrode layer. The piezoelectric material layer is disposed between the sensor electrode layer and the second portion of the first conductive layer. The second conductive layer is disposed on the second portion of the first conductive layer. Materials of the first conductive layer and the second conductive layer include silver. Attaching the fingerprint recognition sensor directly to the display panel can increase the proportion of the area occupied by the display panel in the electronic device.

Description

technical field [0001] The disclosure relates to an electronic device and a manufacturing method of the electronic device. Background technique [0002] With the development of science and technology, electronic products such as smart phones and tablet computers not only have the protection function of character password encryption, but also the protection function of fingerprint identification encryption is gradually integrated into electronic products. Fingerprint identification technology can be divided into optical identification, thermal induction identification, capacitive induction identification and ultrasonic identification according to its principle. Generally speaking, ultrasonic signals have better penetration and can avoid the interference of finger dirt, grease and sweat. In addition, the pulses sent by the ultrasonic sensor can sense the depth of the fingerprint to form three-dimensional information, so the ultrasonic fingerprint identification has higher acc...

AI Technical Summary

Problems solved by technology

[0003] However, in the process of manufacturing ultrasonic sensors, the thickness of the metal electrode layer is often too large, so that the welding of the circuit board needs to be carried out several times, which makes the process time long and cannot meet the needs of users to increase production capacity.

In addition, the excessive thickness of the metal electrode layer also leads to the inability to reduce the size of the ultrasonic fingerprint recognition device

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