Wafer box

Abstract

The invention relates to a wafer box. The wafer box comprises a wafer box body placed on a machine table. The wafer box body comprises a chassis. A supporting framework is arranged on the chassis. The supporting framework comprises a top plate and two left-right symmetrical vertical side plates. A plurality of bearing strips are arranged on the inner side faces of the side plates from top to bottom at intervals. The bearing strips on the left and right sides are in one-to-one correspondence. A transverse lead screw is arranged above of the top plate. A driving motor is arranged at one end of the screw rod. The screw rod is sleeved in a nut base. The front side of the nut base extends forwards and is provided with a connecting part. A stop rod extending downwards is arranged in the connecting part in a penetrating mode. A transverse linear guide rail is arranged below the stop rod. A sliding base is arranged on the linear guide rail. The top face of the sliding base is connected with the bottom end of the stop rod. The wafer box is reasonable in structural design, the wafers can be prevented from being shaken off and damaged, and the rejection rate is reduced.

Description

technical field [0001] The invention relates to a wafer box, which belongs to the technical field of semiconductor manufacturing. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. It can be processed into various circuit element structures on the silicon wafer and become an IC with specific electrical functions. product. In order to ensure the safe storage, transportation, and handling of wafers, wafer boxes are widely used as wafer carrying and transportation tools, so that wafers can be well protected. At present, the structure design of the existing wafer box is unreasonable. In the semiconductor processing process, the wafer box containing the wafers to be processed is usually temporarily stored in the buffer storage area of ​​the processing equipment, and the wafer box is transported by the conveying mechanism parallel to it. The wafe...

AI Technical Summary

Problems solved by technology

At present, the structure design of the existing wafer box is unreasonable. In the semiconductor processing process, the wafer box containing the wafers to be processed is usually temporarily stored in the buffer storage area of ​​the processing equipment, and the wafer box is transported by the conveying mechanism parallel to it. The wafers in the round box are grabbed and transported to the next process in sequence. During this process, the processing equipment shakes due to the dynamic and static assembly of the driving device in the working state, and the wafer box in the buffer storage area is also shaken. , causing the wafers in the wafer box to be displaced and dislocated due to long-term shaking, and some may even shake out of the wafer box and collide with the conveying mechanism next to the wafer box (such as figure 1 As shown, among them: wafer box 1; wafer 2; conveying mechanism 3), damage occurred

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