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This utility model discloses a glue dispensing device, relating to the field of semiconductor testing dotting equipment technology. The glue dispensing device includes a support base, a glue dispensing ink fountain, a drive mechanism, and a limiting member. One side of the support base is the mounting side. The glue dispensing ink fountain includes a mandrel and an ink tank, with the ink tank mounted on the mounting side. A receiving cavity is formed within the ink tank, and the mandrel passes through the receiving cavity, with both ends extending from the two ends of the ink tank. The drive mechanism is mounted on the mounting side and located at one end of the ink tank. The drive mechanism includes a drive component and a transmission shaft, with one end of the transmission shaft connected to the mandrel. The drive component drives the transmission shaft to move, thereby moving the mandrel relative to the ink tank. A glue dispensing port is provided at the end of the ink tank near the drive mechanism. The limiting member is located on the mounting side and can move relative to the support base. The limiting member abuts against the end of the transmission shaft away from the mandrel. This glue dispensing device allows for rapid glue replenishment after use and provides more reliable dotting quality.