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Method for improving solder mask manufacturing efficiency of thick copper plate

A production efficiency, thick copper plate technology, applied in the direction of printed circuit manufacturing, printed circuit secondary treatment, electrical components, etc., can solve the problems of low production efficiency and achieve the effect of reducing the drop

Inactive Publication Date: 2019-09-17
KINWONG ELECTRONICS TECH LONGCHUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the traditional process, it takes at least 4 hours to print the solder mask ink once. If the ink is printed twice or three times according to the solder mask quality requirements, the entire solder mask production will take at least 8 hours or 12 hours, that is, the production efficiency is low.

Method used

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  • Method for improving solder mask manufacturing efficiency of thick copper plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A method for improving the production efficiency of thick copper plate solder mask, comprising steps performed in sequence:

[0025] S0: Sandblasting the etched thick copper circuit board;

[0026] S1: By using an inkjet machine that has been imported into the line gap of the circuit board to print data, use UV curable ink to fill the position of the line gap position of the thick copper circuit board, so that the flatness of the UV curable ink after filling is 5 μm, so that The height difference between the liquid level of the UV curable ink and the copper surface of the circuit is 25 μm;

[0027] S2: The energy of exposing the thick copper circuit board to 465nm is 1250wj / cm 2 Cured under UV light for 30s; use a ceramic brush to remove UV curable ink on the copper surface;

[0028] S3: Printing solder resist ink on the surface of the thick copper circuit board, the solder resist ink printing process includes: first use white screen printing to print solder resist in...

Embodiment 2

[0031] A method for improving the production efficiency of thick copper plate solder mask, comprising steps performed in sequence:

[0032] S0: Sandblasting the etched thick copper circuit board;

[0033] S1: By using an inkjet machine that has been imported into the line gap of the circuit board to print data, use UV curable ink to fill the gap between the lines of the thick copper circuit board, so that the flatness of the UV curable ink after filling is 0 μm, so that The height difference between the liquid level of the UV curable ink and the copper surface of the circuit is 0 μm;

[0034] S2: Exposing the thick copper circuit board to the energy of 485nm is 1000wj / cm 2 Cured under ultraviolet light for 20s; use a ceramic brush to remove UV curable ink on the copper surface;

[0035] S3: Printing solder resist ink on the surface of the thick copper circuit board. The solder resist ink printing process includes: first printing the solder resist ink with white screen printi...

Embodiment 3

[0037] A method for improving the production efficiency of thick copper plate solder mask, comprising steps performed in sequence:

[0038] S0: Sandblasting the etched thick copper circuit board;

[0039] S1: By using an inkjet machine that has been introduced into the line gap of the circuit board to print data, use UV curable ink to fill the gap between the lines of the thick copper circuit board, so that the flatness of the UV curable ink after filling is 10 μm, so that The height difference between the liquid level of the UV curable ink and the copper surface of the circuit is 50 μm;

[0040] S2: The energy of exposing the thick copper circuit board to 465nm is 1500wj / cm 2 Cured under UV light for 40s; use a ceramic brush to remove UV curable ink on the copper surface;

[0041] S3: Printing solder resist ink on the surface of the thick copper circuit board. The solder resist ink printing process includes: first printing the solder resist ink with white screen printing; t...

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Abstract

The invention provides a method for improving the solder mask manufacturing efficiency of a thick copper plate. The method comprises the steps that S1, UV curing ink is used for filling gaps between lines of an etched thick copper circuit board, so the height difference between the liquid level of the UV curing ink and the copper surface of the line is made to be deltaH, wherein the absolute value of the deltaH is smaller than or equal to 50 [mu]m; S2, the thick copper circuit board is exposed to ultraviolet rays, and the UV curing ink is cured; and S3, solder mask ink printing treatment is performed on the surface of the thick copper circuit board. The gaps between the lines of the circuit board are filled with the UV curing ink, so that the fall between the copper surface and the base material is reduced, and the solder mask manufacturing can be completed only by once printing when a thick copper plate circuit is soldered. Only about 20 minutes are needed for the UV curing ink filling, so that the solder mask manufacturing of the thick copper circuit board can be completed within 5 hours. Compared with a traditional method in which at least 8 hours are consumed, the method has the advantages that the solder mask manufacturing efficiency of the thick copper circuit board is greatly improved, and the thickness quality of an oil film at a line corner meets the quality standard requirement.

Description

technical field [0001] The invention relates to the technical field of manufacturing metal-based printed circuit boards, in particular to a method for improving the efficiency of solder mask manufacturing of thick copper plates. Background technique [0002] With the development of the electronics industry, customers are increasingly pursuing the heat dissipation of PCB products. Metal-based thick copper plates are more and more used in high-power lighting and power supply products due to their high-efficiency heat dissipation performance. In general thick copper plate (3OZ) solder resist production, due to the large gap between the copper surface and the substrate, two or three printings are required to ensure that the thickness of the ink at the corner of the line meets the quality requirements. In the traditional process, it takes at least 4 hours to print a solder mask ink once. If the ink is printed twice or three times according to the solder mask quality requirements,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
CPCH05K3/282H05K2203/052
Inventor 邹子誉
Owner KINWONG ELECTRONICS TECH LONGCHUAN