A laser drilling and cutting system for semiconductor materials

Abstract

The invention belongs to the field of semiconductors, in particular to a laser drilling and cutting system for semiconductor materials, aimed at the fact that the waste spatter generated by the existing cutting affects the accuracy of the infrared distance measuring sensor, and it is inconvenient to use the X / Y axis to perform the drilling operation Problem, the following solution is now proposed, which includes a base, the upper side wall of the base is fixedly connected with a mounting seat, the mounting seat is a hollow structure, the inner wall of the mounting seat is fixedly connected with a stepping motor, and the The inner wall is rotatably connected with a ball screw that matches the output shaft of the stepping motor. The upper sliding sleeve of the ball screw is provided with a sliding block, and the upper side wall of the sliding block is fixedly connected with a light barrier. The sliding rods are fixedly connected between the side inner walls, and the measurement of the light baffle by the infrared distance measuring sensor is protected by the mounting seat, reducing the influence of the outside world, improving the accuracy of distance measurement, and the worktable is rotated through the cooperation of the worm and worm gear to complete quickly. Punch cutting.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a laser drilling and cutting system for semiconductor materials. Background technique [0002] A semiconductor refers to a material whose conductivity at room temperature is between that of a conductor and an insulator. Semiconductors have a wide range of applications in radios, televisions, and temperature measurement. For example, a diode is a device made of a semiconductor. A semiconductor is a material whose electrical conductivity can be controlled, ranging from an insulator to a conductor. No matter from the perspective of technology or economic development, the importance of semiconductors is enormous. The core units of most of today's electronic products, such as computers, mobile phones or digital recorders, are closely related to semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is the mos...

AI Technical Summary

Problems solved by technology

[0005] A laser drilling and cutting system for semiconductor materials proposed by the present invention solves the problem that when using a laser cutting device to process semiconductors, the infrared ranging sensor is generally placed in the outside world for distance measurement, which will cause The generated waste affects the measurement accuracy of the infrared distance measuring sensor. In addition, in the prior art, the X / Y axis drives the laser cutting device to move, which is very inconvenient when drilling semiconductors, and the accuracy of drilling into a circle is also low. not high problem

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