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Display panel, display device and packaging method

A technology for display panels and encapsulation adhesives, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as burning of devices in the display area, and achieve the effect of reducing heat and reducing the probability of burns

Active Publication Date: 2019-09-27
WUHAN TIANMA MICRO ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0003] However, since the encapsulant is arranged around the display panel, in the specific encapsulation process, it is necessary to control the laser to irradiate the encapsulant in a direction perpendicular to the plane where the display panel is located, and during the irradiation process, the laser emitting end needs to be irradiated along the encapsulant. The pattern moves, that is, it moves around the display panel, so that the encapsulant everywhere is irradiated by the laser to achieve curing. When the laser emitting end is irradiated on the display panel, a spot with a certain area will be generated. The spot moves along a straight line and the spot Compared with moving along the corner, at the same time, the moving path of the light spot moving along the corner near the display area is smaller than the moving path of the light spot moving along the straight line near the display area, which causes the display panel to be at the corner due to laser Radiation is more concentrated and builds up higher heat, which burns devices in the nearby display area

Method used

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  • Display panel, display device and packaging method
  • Display panel, display device and packaging method
  • Display panel, display device and packaging method

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Embodiment Construction

[0045] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0046] Terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. As used in the embodiments of the present invention and the appended claims, the singular forms "a", "said" and "the" are also intended to include the plural forms unless th...

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Abstract

The embodiment of the invention provides a display panel, a display device and a packaging method, relates to the technical field of display, and can reduce the probability that a device in a display area near a corner of the display panel is burnt in a packaging process. The display panel comprises a display area and a frame area surrounding the display area, and the frame area comprises a laser reflection corner area; a first substrate and a second substrate which are opposite to each other; in the frame area, packaging glue is arranged between the first substrate and the second substrate; and the laser reflection corner area is provided with a reflection structure. The film layer where the reflection structure is located is located at the side, away from the film layer where the first substrate is located, of the film layer where the packaging adhesive is located. And in the direction perpendicular to the plane where the display panel is located in the laser reflection corner area, the orthographic projection of the reflection structure is located between the orthographic projection of the packaging adhesive and the display area.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a display panel, a display device and a packaging method. Background technique [0002] Existing display panels include a first display substrate and a second glass substrate, and encapsulation is performed between the first display substrate and the second glass substrate. Making encapsulation glue, after baking, bonding the second glass substrate with the encapsulation glue on the first display substrate, and then performing laser sintering, and curing the encapsulation glue by laser irradiation, so as to realize the encapsulation of the display panel. [0003] However, since the encapsulant is arranged around the display panel, in the specific encapsulation process, it is necessary to control the laser to irradiate the encapsulant in a direction perpendicular to the plane where the display panel is located, and during the irradiation process, the laser emitting end ne...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56H01L27/32B29C35/08
CPCB29C35/0805B29C2035/0838H10K59/00H10K50/84H10K71/00
Inventor 高秋圆
Owner WUHAN TIANMA MICRO ELECTRONICS CO LTD
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