A special unloading assembly for bonding gold wire and its use method

Abstract

The invention discloses a special unloading assembly for bonding wire, belonging to the technical field of bonding wire production equipment, wherein a fixed shell is fixedly connected with a mechanical arm, and a third incomplete gear and a fourth gear are horizontally installed on the fixed shell. , the fifth gear, the fourth incomplete gear, the fourth gear meshes with the third incomplete gear and the fifth gear respectively, the other side of the fifth gear meshes with the fourth incomplete gear, and the third incomplete gear meshes with the first swing arm Fixed connection, the fourth incomplete gear is fixedly connected with the second swing arm, the other end of the first swing arm is hinged with the first mechanical claw, the other end of the second swing arm is hinged with the second mechanical claw, and one end of the first link is hinged with the fixed shell The other end is hinged with the first mechanical claw, one end of the second link is hinged with the fixed shell, the other end is hinged with the second mechanical claw, and the fourth gear is connected with the biaxial motor; the invention also provides a method of using the device.

Description

technical field [0001] The invention belongs to the technical field of bonding gold wire packaging equipment, and in particular relates to a special unloading assembly for bonding gold wire and a use method thereof. Background technique [0002] Bonding is an important step in the production of integrated circuits, which is the operation of connecting circuit chips and lead frames. Bonding gold wire is a fine metal wire inner lead used for electrical connection between the input / output bonding point of the chip circuit and the inner contact point of the lead frame when semiconductor devices and integrated circuits are assembled. The quality of the bonding effect directly affects the performance of the integrated circuit. Bonding gold wire is one of the five basic materials in the overall IC packaging material market. It is an inner lead material with excellent electrical, thermal conductivity, mechanical properties and excellent chemical stability. It is an important struct...

AI Technical Summary

Problems solved by technology

[0003] In the existing production process of bonded gold wire, after the bonded gold wire is wound onto the reel, the bonded gold wire reel is usually arranged and boxed manually, and the bonded gold wire reel is taken out one by one by hand. The number is limited, which leads to problems such as heavy workload, potential safety hazards, low production efficiency, and high operating costs.

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