Chip component slitting, forming, testing, and tape linkage integrated machine

Abstract

The invention discloses an integrated machine for slitting, forming, detecting, braiding and braiding of chip elements. A turntable mechanism, the periphery of the turntable mechanism is sequentially provided with a first lead wire bending mechanism, a second lead wire bending mechanism, an electrical measurement mechanism, a first defective product discharge groove, a CCD shape detection mechanism, a second defective product discharge groove and a lower The material braiding mechanism, the forming drive mechanism is installed on the lower side of the frame, the forming drive mechanism drives the first lead wire bending mechanism and the second lead wire bending mechanism, and the first lead wire bending mechanism and the second lead wire bending mechanism are connected with the turntable The mechanism cooperates to operate, and the unloading and braiding mechanism includes a braiding channel. Along the braiding channel, a tape loading station, a CCD tape loading detection mechanism, a cover tape mechanism and a tape carrier winding reel are arranged in sequence. The invention realizes automatic cutting, forming, testing and packaging of chip components, improves the taping efficiency and saves the taping cost.

Description

technical field [0001] The invention relates to an integrated machine for slitting, forming, and testing, in particular to an integrated machine for slitting, forming, testing, and braiding of chip components, which belongs to the technical field of chip component processing equipment. Background technique [0002] With the development of science and technology and the improvement of electronic technology level, as well as the miniaturization of electronic products, the further improvement of performance and reliability, electronic components have developed from large, heavy and thick to small, light and thin. Capacitors, thermistors, varistors and other chip components, chip components need to go through chip welding, plastic sealing, slitting, lead forming, taping and other processes in the production process, traditional chip component production requires different equipment It is carried out step by step, and there are many manual parts involved, the processing cost is h...

AI Technical Summary

Problems solved by technology

[0002] With the development of science and technology and the improvement of the level of electronic technology, as well as the miniaturization of electronic products, the further improvement of performance and reliability, electronic components have developed from large, heavy, and thick to small, light, and thin. Capacitors, thermistors, varistors and other chip components, chip components need to go through chip welding, plastic sealing, slitting, lead forming, taping and other processes in the production process, traditional chip component production requires different equipment It is carried out step by step, there are many manual parts involved, the processing cost is high, the processing efficiency is low, and it is easy to produce waste components

Images